Resist stripping method and resist stripping apparatus
View Patent ↗After the resist stripping liquid is supplied to the surface of the substrate which is being rotated at a first rotational speed, the rotational speed of the substrate is reduced from the first rotational speed to a second rotational speed with the supply of the resist stripping liquid to the surface of the substrate continued, thereby forming a liquid film by a mount of the resist stripping liquid on the surface of the substrate and then, maintaining a state where the liquid film is formed.
1. A resist stripping method for stripping a resist formed on a surface of a substrate using a resist stripping liquid produced by mixing a sulfuric acid and a hydrogen peroxide solution, comprising:
a substrate holding step performed by holding the substrate to be processed with its surface directed upward by a substrate holding mechanism;
a substrate rotating step performed by rotating the substrate held by the substrate holding mechanism around an axis crossing the surface of the substrate;
a resist stripping liquid supplying step performed by supplying the resist stripping liquid to the surface of the substrate and stripping the resist during the substrate rotating step;
a speed reducing step performed by reducing the rotational speed of the substrate from a first rotational speed to a second rotational speed lower than the first rotational speed during the resist stripping liquid supplying step; and
after the speed reducing step, a puddling step performed by maintaining a liquid film formed by an amount of the resist stripping liquid by surface tension and without flowing on the surface of the substrate and thereby further stripping the resist;
further comprising a supply position moving step performed by moving the position where the resist stripping liquid is supplied on the surface of the substrate from a peripheral portion of the substrate to a center of the substrate during the resist stripping liquid supplying step; and
wherein in the supply position moving step, the movement of the supply position is stopped at the peripheral portion on the surface of the substrate only for a predetermined time period from the beginning of supply of the resist stripping liquid, and then the supply position is moved from the peripheral portion to the center.
2. The resist stripping method according to claim 1 , wherein the supply position moving step is carried out while the substrate is being rotated at the first rotational speed before the speed reducing step.
3. The resist stripping method according to claim 1 , wherein the resist stripping liquid supplying step continues after the speed reducing step is completed.
4. The resist stripping method according to claim 1 , wherein the first rotational speed is set to a rotational speed of not less than 1000 rpm.