Plasma processing apparatus
View Patent ↗A plasma processing apparatus includes a chamber having a support for a substrate, and at least one gas inlet into the chamber. The apparatus is configured to alternately introduce an etch gas and a deposition gas into the chamber through the at least on gas inlet, and to strike a plasma into the etch gas and the deposition gas alternately introduced into the chamber. The apparatus is further equipped with an attenuation device for reducing and/or homogenizing the ion flux from the plasma substantially without affecting the neutral radical number density.
1. A method of etching a feature in a substrate in a chamber, the method comprising:
striking a plasma in the chamber, the plasma having an ion flux therefrom with a radical number density;
alternately etching the substrate and depositing a passivation layer on the substrate; and
reducing the ion flux from the plasma using an attenuation means substantially without affecting the radical number density,
wherein a strength of the attenuation means is varied for each of the deposition and/or etching steps, and in which the attenuation means comprises means for creating an electromagnetic field which is reduced or switched off during the deposition.
2. A method of etching a feature in a substrate in a chamber, the method comprising:
striking a plasma in the chamber, the plasma having an ion flux therefrom with a radical number density;
alternately etching the substrate and depositing a passivation layer on the substrate; and
reducing the ion flux from the plasma substantially without affecting the radical number density,
wherein power is supplied to the plasma during the etching and deposition, and wherein the power supplied during the etching is greater than that during the deposition.
3. A method of etching a feature in a substrate, comprising:
conducting a switched process cycle in which a deposition step and an etch step are cyclically executed within a chamber containing the substrate, wherein the switched process cycle includes alternately and repeatedly introducing an etch gas and a deposition gas into the chamber through the at least one gas inlet, wherein the deposition gas is different than the etch gas, wherein the deposition gas is for the deposition step of each cycle in which a passivation layer is deposited on the substrate and the etch gas is for the etch step of each cycle in which the passivation layer is selectively removed;
striking a plasma into the etch gas and the deposition gas alternately introduced into the chamber, the plasma having an ion flux therefrom;
partially reducing the ion flux from the plasma to obtain attenuated plasma in which sufficient ions are available to selectively remove the passivation layer during the etch step of each cycle; and
accelerating the available ions onto the substrate.