Patent Assignment
Reel/Frame 035364/0295
Security Interest
Recorded: 2015-04-02
Pages: 22
Assignor
SPTS TECHNOLOGIES LIMITED
Executed: 2015-04-01
Assignee
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
10 S. DEARBORN, 7TH FLOOR, CHICAGO, ILLINOIS, 60603
Covered Properties
(140)
Method for Filing Substrate Recesses Using Elevated Temperature and Pressure
Patent:
5,527,561 →
Application:
08/291,575 →
Forming a Layer
Patent:
5,843,535 →
Application:
08/530,195 →
Processing System
Patent:
5,575,850 →
Application:
08/591,026 →
Inductively Coupled Plasma Reactor and Process
Patent:
5,683,548 →
Application:
08/605,697 →
Single Body Injector and Method for Delivering Gases to a Surface
Patent:
5,683,516 →
Application:
08/621,772 →
Temperature Sensing Methods and Apparatus
Patent:
5,755,512 →
Application:
08/637,599 →
Method of Stress-Relieving Silicon Oxide Films
Patent:
5,786,278 →
Application:
08/704,227 →
Method of Processing a Workpiece
Patent:
6,514,389 →
Application:
08/727,303 →
Method for Filling Substrate Recesses Using Pressure, and Heat Treatment
Patent:
5,932,289 →
Application:
08/831,600 →
Exhaust Vent Assembly for Chemical Vapor Deposition Systems
Patent:
5,938,851 →
Application:
08/838,882 →
Method of Manufacturing an Injector for Chemical Vapor Deposition Processing
Patent:
5,935,647 →
Application:
08/869,085 →
Single Body Injector and Method for Delivering Gases to a Surface
Patent:
6,022,414 →
Application:
08/892,469 →
Controlled Etching of Oxides via Gas Phase Reactions
Patent:
38,760 →
Application:
08/903,077 →
Method of Surface Treatment of Semiconductor Substrates
Patent:
6,051,503 →
Application:
08/904,953 →
Method of Surface Treatment of Semiconductor Substrates
Patent:
6,261,962 →
Application:
08/904,954 →
Method and Structure for Controlling Plasma
Patent:
6,110,395 →
Application:
08/918,852 →
Plasma Processing Apparatus with Coils in Dielectric Windows
Patent:
6,259,209 →
Application:
08/938,995 →
Method of Removing Surface Oxides Found on a Titanium Oxynitride Layer Using a Nitrogen Containing Plasma
Patent:
6,169,027 →
Application:
08/975,449 →
Methods of Forming a Barrier Layer
Patent:
6,174,823 →
Application:
08/975,705 →
Protective Gas Shield for Chemical Vapor Deposition Apparatus
Patent:
5,944,900 →
Application:
08/976,928 →
Free Floating Shield
Patent:
5,849,088 →
Application:
09/008,024 →
Method for Using a Hard Mask for Critical Dimension Growth Containment
Patent:
6,287,975 →
Application:
09/009,369 →
Wafer Carrier and Semiconductor Apparatus for Processing a Semiconductor Substrate
Patent:
6,026,589 →
Application:
09/018,021 →
Apparatus for Applying Pressure to a Coated Surface of a Workpiece
Patent:
6,019,847 →
Application:
09/055,185 →
Method and Apparatus for Etching a Workpiece
Patent:
6,409,876 →
Application:
09/065,622 →
Improved Metal Oxide Semiconductor Device Having Contoured Channel Region and Elevated Source and Drain Regions
Single Body Injector and Deposition Chamber
Patent:
6,200,389 →
Application:
09/113,823 →
Plasma Processing Apparatus
Patent:
6,458,239 →
Application:
09/142,542 →
Electrostatic Chucks
Patent:
6,256,186 →
Application:
09/150,669 →
Platen for Semiconductor Workpieces
Patent:
6,188,563 →
Application:
09/152,673 →
Free Floating Shield and Semiconductor Processing System
Patent:
6,056,824 →
Application:
09/185,180 →
Plasma Reactor with a Deposition Shield
Patent:
6,006,694 →
Application:
09/204,020 →
A Method and Apparatus for Etching a Substrate
Patent:
6,187,685 →
Application:
09/245,861 →
Foil for Use in Filing Substrate Recesses
Patent:
6,274,245 →
Application:
09/339,401 →
Plasma Reactor with a Deposition Shield
Patent:
6,360,686 →
Application:
09/382,050 →
Apparatus and Methods for Sputtering
Patent:
6,179,974 →
Application:
09/414,717 →
Method and Apparatus for Manufacturing a Micromechanical Device
Patent:
6,355,181 →
Application:
09/423,979 →
Plasma Reactor with a Deposition Shield
Patent:
6,173,674 →
Application:
09/434,092 →
Plasma Reactor with a Deposition Shield
Patent:
6,170,431 →
Application:
09/434,990 →
Apparatus for Processing Workpieces
Patent:
6,454,367 →
Application:
09/446,432 →
Plasma Processing Apparatus
Patent:
6,239,404 →
Application:
09/462,147 →
Method of Filling a Recess
Patent:
6,423,635 →
Application:
09/462,465 →
Sputtering Apparatus
Chemical Vapor Deposition System and Method
Patent:
6,206,973 →
Application:
09/480,730 →
Free floating shield and semiconductor processing system
Patent:
6,352,592 →
Application:
09/492,420 →
Wafer processing reactor having a gas flow control system and method
Patent:
6,143,080 →
Application:
09/493,492 →
Gas Delivery System
Patent:
6,468,386 →
Application:
09/518,141 →
Method and Depositing a Layer
Deposition Apparatus
Patent:
6,533,868 →
Application:
09/568,987 →
Protective Gas Shield Apparatus
Patent:
6,576,060 →
Application:
09/574,826 →
Thermal Isolation Using Vertical Structures
Patent:
6,566,725 →
Application:
09/628,201 →
Plasma Vacuum Substrate Treatment Process and System
Patent:
6,431,113 →
Application:
09/634,988 →
Inductive Coil Assembly Having Multiple Coil Segments for Plasma Processing Apparatus
Patent:
6,495,963 →
Application:
09/673,081 →
Gas Delivery System
Patent:
6,602,433 →
Application:
09/674,658 →
Gas Generation System
Patent:
6,926,871 →
Application:
09/674,659 →
Chlorotrifuorine Gas Generator System
Patent:
6,929,784 →
Application:
09/674,660 →
Method and Apparatus for Stablizing a Plasma
Patent:
7,306,745 →
Application:
09/674,925 →
Thermal Isolation Using Vertical Structures
Method for Using a Hard Mask for Critical Dimension Growth Containment
Patent:
6,958,295 →
Application:
09/692,007 →
Method of Forming a Barrier Layer
Patent:
6,402,907 →
Application:
09/704,714 →
Method and Apparatus for Dechucking a Substrate from an Electrostatic Chuck
Patent:
6,628,500 →
Application:
09/719,500 →
Method and Apparatus for Anisotropic Etching
Patent:
7,141,504 →
Application:
09/744,212 →
Single Body Injector and Deposition Chamber
Method of Cooling an Induction Coil
Apparatus for Etching Semiconductor Samples and a Source for Providing a Gas by Sublimation Thereto
Deposition Shield for a Plasma Reactor
Plasma Processing Apparatus
Plasma Processing Apparatus
High Pressure Seal
Semiconductor Wafer Processing System with Vertically-Stacked Process Chambers and Single-Axis Dual-Wafer Transfer System
Plasma Etching
Patent:
6,933,242 →
Application:
10/018,809 →
Method for Using a Hard Mask for Critical Dimension Growth Containment
Method of Etching a Substrate
Electrostatic Clamping
Modular Injector and Exhaust Assembly
Atmospheric Pressure Wafer Processing Reactor Having an Internal Pressure Control System and Method
Methods of Forming Nitride Films
Magnetron Sputtering
Method of Forming a Patterned Metal Layer
Method of Depositing Dielectric
Plasma Processing Apparatus
Barrier Layer and Method of Depositing a Barrier Layer
Plasma Processing Apparatus
Shutter
Deposition Methods and Apparatus
Methods and Apparatus for Forming Precursors
Depositing a Tantalum Film
Method of Forming an Acoustic Resonator
Method of Depositing a Layer
Heating System, Method for Heating a Deposition or Oxidation Reactor, and Reactor Including the Heating System
Methods of Depositing Piezoelectric Films
Gas Distribution System
Patent:
6,921,437 →
Application:
10/854,869 →
Method and Apparatus for Non-Aggressive Plasma-Enhanced Vapor Deposition of Dielectric Films
Method of Forming a Substantially Closed Void
Method of Forming a Diffusion Barrier
Systems and Methods for Achieving Isothermal Batch Processing of Substrates Used for the Production of Micro-Electro-Mechanical-Systems
Acoustic Resonators
Magnet Assemblies
Plasma Processing Apparatus
Rf Stand Offs
Method of Processing a Workpiece
Method of Forming Amorphous Tin by Thermal Chemical Vapor Deposition (Cvd)
Acoustic Resonators
Methods and Apparatus for Sputtering
Apparatus and a Method for Controlling the Depth of Etching During Alternating Plasma Etching of Semiconductor Substrates
Selective Etching of Oxides from Substrates
Etching Chamber with Subchamber
Method of Processing Substrates
Pulsed Etching Cooling
Pulsed-Continuous Etching
Ion Source Including Separate Support Systems for Accelerator Grids
Plasma Sources
Ion Deposition Apparatus Having Rotatable Carousel for Supporting a Plurality of Targets
Pulsed Etching Cooling
Method of Plasma Vapour Deposition
Method of forming and patterning conformal insulation layer in vias and etched structures
Application:
12/712,339 →
Publication:
US 2011/0207323
Apparatus for Chemically Etching a Workpiece
Selective Etching Of Semiconductor Substrate(s) That Preserves Underlying Dielectric Layers
Method of Depositing Amorphus Aluminium Oxynitride Layer by Reactive Sputtering of an Aluminium Target in a Nitrogen/Oxygen Atmosphere
Ion Beam Source
Methods of Depositing SIO2 Films
Application:
12/972,602 →
Publication:
US 2011/0318502
Gas Delivery Device
Application:
13/054,033 →
Publication:
US 2011/0268891
Composite Shielding
Methods of Depositing Aluminium Layers
Mass Flow Control Monitoring
High-Selectivity Etching System and Method
Application:
13/512,634 →
Publication:
US 2012/0244715
Method of Supporting a Workpiece During Physical Vapour Deposition
Etching Apparatus and Methods
Positive Displacement Pumping Chamber
Process Chamber Pressure Control System and Method
Method of Depositing Silicone Dioxide Films
Method of Etching
Method and Apparatus for Processing a Semiconductor Workpiece
Process for Manufacturing Electro-Mechanical Systems
Method of Plasma Etching
Method of Depositing an Amorphous Silicon Film
Application:
14/056,529 →
Publication:
US 2014/0113439
Etching Apparatus and Methods
Plasma Etching Apparatus
Application:
14/285,727 →
Publication:
US 2015/0102011
Apparatus for Processing a Semiconductor Workpiece
Application:
14/285,730 →
Publication:
US 2014/0352889
Pre-Cleaning a Semiconductor Structure
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 16, 2012
From: TEGAL CORPORATION
To: SPP PROCESS TECHNOLOGY SYSTEMS UK LIMITED
Reel/Frame 029309/0193 →
Change of Name
Dec 5, 2012
From: SPP PROCESS TECHNOLOGY SYSTEMS UK LIMITED
To: SPTS TECHNOLOGIES LIMITED
Reel/Frame 029405/0169 →
Assignment of Assignor's Interest
Jan 30, 2015
From: TRIKON EQUIPMENTS LIMITED
To: SPP PROCESS TECHNOLOGY SYSTEM UK LIMITED
Reel/Frame 034856/0357 →
Change of Name
Feb 3, 2015
From: SPP PROCESS TECHNOLOGY SYSTEM UK LIMITED
To: SPTS TECHNOLOGIES LIMITED
Reel/Frame 034876/0529 →
Assignment of Assignor's Interest
Feb 19, 2015
From: TRIKON TECHNOLOGIES, INC.
To: SPP PROCESS TECHNOLOGY SYSTEMS UK LIMITED
Reel/Frame 034987/0764 →
Change of Name
Feb 20, 2015
From: SPP PROCESS TECHNOLOGY SYSTEM UK LIMITED
To: SPTS TECHNOLOGIES LIMITED
Reel/Frame 034998/0707 →
Release of Security Interest
Sep 14, 2015
From: JPMORGAN CHASE BANK, N.A.
To: SPTS TECHNOLOGIES LIMITED
Reel/Frame 036558/0351 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
Assignment of Assignor's Interest
Feb 17, 2016
From: SPTS TECHNOLOGIES, INC.; SPTS TECHNOLOGIES LIMITED
To: SPP TECHNOLOGIES CO., LTD.
Reel/Frame 037746/0599 →
Release of Security Interest
Jul 5, 2016
From: JPMORGAN CHASE BANK, N.A.
To: SPTS TECHNOLOGIES LIMITED
Reel/Frame 039257/0026 →