Method of processing substrates
View Patent ↗This invention relates to a method of processing substrates including: (a) etching, in a chamber, a generally vertical structure in a substrate using a cyclic process including an etch step using a reactive etch gas and a deposition step for depositing a protective polymer on to the side walls of that part of the structure which has already been etched by a preceding etch step or steps; and (b) cleaning, in the absence of any substrate, the chamber of material deposited thereon by the performance of the deposition step in step (a) characterized in that following the cleaning of the deposition derived material, the chamber is cleaned of material derived from the etchant gas by exposing the chamber to a plasma containing a mixture of O 2 and at least the active element of elements of the etchant gas.
1. A method of processing substrates, comprising:
(a) performing a cyclic process, in a chamber, on a substrate to form an opening therein delimited by generally vertical side wall surfaces,
wherein the cyclic process includes an etch step of removing a portion of the substrate with a reactive etchant gas and a subsequent deposition step of depositing a protective polymer onto the side wall surfaces which delimit the opening of that part of the structure which has already been formed by the preceding etch step or steps, and the etchant gas includes at least an active element and a non-active element; and
(b) cleaning the chamber, in the absence of any substrate in the chamber, of material deposited thereon by the performance of the deposition step of the cyclic process of step (a), by:
first cleaning the chamber of the polymer; and
subsequently cleaning the chamber of the non-active element of the etchant gas by introducing O 2 gas and a catalyst into the chamber at respective flow rates, and generating a plasma from the O 2 gas and the catalyst to expose the chamber to a plasma containing a mixture of the O 2 gas and the catalyst,
wherein the catalyst includes at least the active element of the etchant gas and the flow rate at which the O 2 gas is introduced into the chamber is greater than that at which the catalyst is introduced into the chamber, so that the catalyst causes a breaking of bonds of the non-active element derived from the etchant gas and such that the non-active element derived from the etchant gas is stripped from surfaces of the chamber by the O 2 gas.
2. A method as claimed in claim 1 wherein the mixture in step (b) is O 2 and the etchant gas.
3. A method as claimed in claim 2 wherein the etchant gas is SF 6 .
4. A method as claimed in claim 1 wherein the active element is fluorine.
5. A method as claim in claim 4 wherein the non-active element is sulfur (S).
6. A method as claim in claim 1 wherein the non-active element is sulfur (S).
7. A method as claim in claim 5 , wherein the mixture is O 2 and SF 6 , and the following reaction occurs in cleaning the chamber of the non-active element:
S(solid)+2O+SF 4 +2F→SO 2 F 2 (gas)+SF 4 ⇄SO 2 (gas)+SF 6 (gas).