IP Library Granted Patent US 9,957,608
Granted Patent B2
US 9,957,608 · App. 13/371,642 · Granted May 1, 2018

Composite shielding

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Quick Facts
Patent No.
US 9,957,608
App. No.
13/371,642
Granted
May 1, 2018
Kind
B2
Abstract

A composite shield assembly is for use in deposition apparatus defining a work piece location. The assembly includes a first shield element for position circumjacent the work piece location and a second shield element for extending around and carrying the first element. The thermal conductivity of the first element is greater than that of the second element, and the elements are arranged for intimate thermal contact.

Claims (38)

1. A composite shield assembly for use in deposition apparatus defining a workpiece location, the assembly including:

a first shield element, constituting a shadow shield, for positioning circumjacent the workpiece location; and

a second shield element extending around and carrying the first element, and

wherein the first shield element consists of aluminium or an alloy thereof and the second shield element consists of stainless steel so that the thermal conductivity of the first element is greater than that of the second element, and

the first element is disposed within and press or friction fit to the second element to place the first and second elements in contact with one another such that thermal energy will thereby transfer directly from the first element to the second element by conduction.

2. A deposition chamber comprising:

support structure defining a workpiece location at which a workpiece is processed; and

a composite shield assembly including a first shield element circumjacent the workpiece location and configured as a shadow shield around the workpiece location, and a second shield element extending around and carrying the first element, and

wherein the first shield element consists of aluminium or an alloy thereof and the second shield element consists of stainless steel so that the thermal conductivity of the first element is greater than that of the second element, and

the first element is disposed within and press or friction fit to the second element such that the elements contact one another and thermal energy will transfer from the first element to the second element by conduction.

3. The chamber as claimed in claim 2 and having a chamber wall defining therein a processing space in which the workpiece location is defined and wherein the second element is disposed against the chamber wall so as to extend therealong and mounts the first element on the chamber wall.

4. The chamber as claimed in claim 3 wherein the second element forms a shield for part of the chamber wall.

5. A deposition apparatus comprising the deposition chamber as claimed in claim 2 ; and

a power supply that delivers power to the deposition chamber,

wherein the deposition chamber comprises:

support structure defining the workpiece location where a workpiece is processed.

6. The apparatus as claimed in claim 5 wherein the power supply is configured to deliver at least 30 kW to the deposition chamber.

7. The assembly as claimed in claim 1 wherein the first element is an annular element consisting of aluminum or an alloy thereof, and the second element is a cylindrical element consisting of stainless steel, and the first and second elements have an interface along an annular region of the assembly.

8. The assembly as claimed in claim 7 wherein the press or friction fit of the first element to the second element exists along the annular region such that thermal energy will transfer directly across the interface from an annular aluminium or aluminium alloy face of the first element to an annular stainless steel face of the second element.

9. The deposition chamber as claimed in claim 2 wherein the first element of the shield assembly is an annular element consisting of aluminum or an alloy thereof, and the second element of the shield assembly is a cylindrical element consisting of stainless steel, and the first and second elements have an interface along an annular region of the assembly.

10. The deposition chamber as claimed in claim 9 wherein the press or friction fit of the first element to the second element exists along the annular region such that thermal energy will transfer directly across the interface from an annular aluminium or aluminium alloy face of the first element to an annular stainless steel face of the second element.

11. The deposition apparatus as claimed in claim 5 wherein the first element of the shield assembly is an annular element consisting of aluminum or an alloy thereof, and the second element of the shield assembly is a cylindrical element consisting of stainless steel, and the first and second elements have an interface along an annular region of the assembly.

12. The deposition apparatus as claimed in claim 11 wherein the press or friction fit of the first element to the second element exists along the annular region such that thermal energy will transfer directly across the interface from an annular aluminium or aluminium alloy face of the first element to an annular stainless steel face of the second element.

13. The assembly as claimed in claim 1 , wherein the second shield element projects radially inwardly from a location at which the first shield element is carried by the second shield element to a location under the first shield element.

14. The assembly as claimed in claim 7 , wherein the radially innermost portion of the annular first shield element tapers in a radially inward direction.

15. The deposition chamber as claimed in claim 2 , wherein the second shield element projects radially inwardly from a location at which the first shield element is carried by the second shield element to a location under the first shield element.

16. The deposition chamber as claimed in claim 2 , wherein the bottom surface of the radially innermost portion of the annular first shield element is disposed above the level of the uppermost surface of the support structure, the uppermost surface of the support structure being a planar surface against which the workpiece rests as it is processed in the apparatus.

17. The deposition chamber as claimed in claim 16 , wherein the radially innermost portion of the annular first shield element tapers in a radially inward direction.

18. The apparatus as claimed in claim 6 , wherein the bottom surface of the radially innermost portion of the annular first shield element is disposed above the level of the uppermost surface of the support structure, the uppermost surface of the support structure being a planar surface against which the workpiece rests as it is processed in the apparatus.

19. The apparatus as claimed in claim 6 , wherein the deposition chamber has a chamber wall including an inner peripheral surface delimiting a processing space in which the support structure is located, and

the second element of the composite shield assembly has an outer peripheral surface disposed against the inner peripheral surface of the chamber wall so as to extend therealong, and the second element mounts the first element on the chamber wall.

20. A composite shield assembly made by a process of:

providing a first shield element consisting of aluminium or an alloy thereof, as a shadow shield, for positioning circumjacent the workpiece location;

providing a second shield element consisting of stainless steel so that the thermal conductivity of the first element is greater than that of the second element, and

wherein the first shield element has a circumferential portion, and the second shield element also has a circumferential portion,

the circumferential portions have inner and outer diameters, respectively, and

the outer diameter is greater than the inner diameter by an amount in a range of +0.1 to +0.3 mm; and

forcing the circumferential portions together with the circumferential portion having the outer diameter disposed within the circumferential portion having the inner diameter to press or friction fit the first shield element to the second shield element and thereby place the first and second elements in contact with one another such that thermal energy will transfer directly from the first element to the second element, via the circumferential portions thereof, by conduction.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jul 5, 2016
From: JPMORGAN CHASE BANK, N.A.
To: SPTS TECHNOLOGIES LIMITED
Reel/Frame 039257/0026 →
SECURITY INTEREST Recorded Apr 2, 2015
From: SPTS TECHNOLOGIES LIMITED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035364/0295 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT TO ADD THE SECOND INVENTOR AND CORRECT THE NAME AND ADDRESS OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 027779 FRAME 0930. ASSIGNOR(S) HEREBY CONFIRMS THE SECOND ASSIGNOR IS MONCRIEFF, IAN AND THE ASSIGNEE IS SPTS TECHNOLOGIES LIMITED.. Recorded Jul 17, 2012
From: WIDDICKS, CLIVE LUCA; MONCRIEFF, IAN
To: SPTS TECHNOLOGIES LIMITED
Reel/Frame 028583/0195 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 29, 2012
From: WIDDICKS, CLIVE LUCA
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 027779/0930 →