Granted Patent
Utility
US 6,026,589 · App. 09/018,021
Wafer carrier and semiconductor apparatus for processing a semiconductor substrate
Inventors:
Jack Yao, Robert J. Bailey
Patented Case
View Patent ↗
Granted: Feb 22, 2000
Filed: Feb 2, 1998
Inventors
Jack Yao
Robert J. Bailey
Assignee (at issue)
Silicon Valley Group, Thermal Systems LLP
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.