Methods of depositing aluminium layers
View Patent ↗A method of depositing an aluminum film on a substrate includes placing the substrate on a support, depositing a first layer of aluminum onto the substrate with the substrate in an unclamped condition, clamping the substrate to the support and depositing a second layer of aluminum continuous with the first layer. The second layer is thicker than the first layer and the second layer is deposited at a substrate temperature of less than about 22° C.
1. A method of depositing a film on a substrate, comprising:
placing the substrate on a support;
depositing material comprising aluminum onto the substrate while the substrate is supported by but is unclamped relative to the support and under a condition in which the temperature of the substrate increases, to thereby form a first metallic layer consisting of aluminum or an aluminum alloy on the substrate; and
subsequently depositing material comprising aluminum directly onto the first layer to form a second metallic layer, consisting of aluminum or an aluminum alloy, continuously on the first layer, and
wherein the depositing of the material to form the second layer is carried out while the substrate is supported by and clamped to a support and is actively cooled to a temperature of less than about 22° C., and until the second layer is thicker than the first layer.
2. The method as claimed in claim 1 wherein an RF bias is provided to the support to which the substrate is clamped while the second layer is being formed.
3. The method as claimed in claim 2 wherein the RF power is between 100 and 500 w.
4. The method is claimed in claim 1 wherein the first layer is formed to be about 0.5 to 2 μm thick.
5. The method as claimed in claim 4 wherein the second layer is formed to be about 7 μm thick.
6. The method is claimed in claim 2 wherein the first layer is formed to be about 0.5 to 2 μm thick.
7. The method as claimed in claim 6 wherein the second layer is formed to be about 7 μm thick.
8. The method as claimed in claim 1 wherein the first and second layers are formed such that the ratio of the thickness of the first layer to the thickness of the second layer is between 1:3 and 1:15.
9. The method as claimed in claim 2 wherein the the first and second layers are formed such that the ratio of the thickness of the first layer to the thickness of the second layer is between 1:3 and 1:15.
10. The method as claimed in claim 1 wherein the supports that support the substrate while the first and second layers are formed, respectively, are different supports.
11. The method as claimed in claim 1 wherein the depositing to form the first layer and the depositing to form the second layer are carried out while the substrate is supported by the same support.
12. The method as claimed in claim 8 wherein the depositing to form the second layer is continuous with the depositing to from the first layer and is initiated by the clamping of the substrate.
13. The method as claimed in claim 1 wherein the substrate is less than 250 μm thick.
14. The method as claimed in claim 1 wherein the substrate is a silicon wafer.
15. The method as claimed in claim 1 where the depositing to form the second layer is carried out while the temperature of the substrate is actively cooled to be less than about 20° C.
16. The method as claimed in claim 1 wherein the first and second layers are both a layer of an aluminum alloy.
17. The method is claimed in claim 1 wherein the depositing to form the first layer is carried out using plasma and while the temperature of the substrate increases, as a result of the heat of the plasma and latent heat of deposition, to a temperature substantially greater than that of the support which supports the substrate while the first layer is being formed.
18. The method is claimed in claim 1 wherein the depositing to form the first layer and the depositing to form the second layer both are physical vapor deposition processes comprising sputtering.