Method and apparatus for processing a semiconductor workpiece

1. A method of processing a semiconductor workpiece having a front surface and a back surface, including the steps of:

i) placing the back surface of the workpiece on a workpiece support in a chamber so that the front surface of the workpiece faces into the chamber for processing, the chamber having an associated chamber gas pressure, and the back surface is in fluid communication with a back region having an associated back gas pressure;

ii) performing a workpiece processing step at a first chamber pressure P c1 and a first back pressure P b1 , wherein P c1 and P b1 give rise to a pressure differential, P b1 −P c1 , which is maintained so as to avoid a pressure induced loss of contact between the workpiece and the workpiece support; and

iii) performing a workpiece cooling step at a second chamber pressure P c2 and a second back pressure P b2 , wherein P c2 and P b2 are higher than P c1 and P b1 , respectively, at least P b2 being sufficiently high to enhance cooling of the workpiece, and wherein P c2 and P b2 give rise to a pressure differential, P b2 −P c2 , which is maintained so as to avoid a pressure-induced loss of contact between the workpiece and the workpiece support.

2. A method accordingly to claim 1 in which, in step iii), P c2 is sufficiently high to enhance cooling of the workpiece.

3. A method of processing a semiconductor workpiece having a front surface and a back surface, including the steps of:

i) placing the back surface of the workpiece on a workpiece support in a chamber so that the front surface of the workpiece faces into the chamber for processing, the chamber having an associated chamber gas pressure, and the back surface is in fluid communication with a back region having an associated back gas pressure;

ii) performing a workpiece processing step at a first chamber pressure P c1 and a first back pressure P b1 , wherein P c1 and P b1 give rise to a pressure differential, P b1 −P c1 , which is maintained at less than +2 Torr;

iii) performing a workpiece cooling step at a second chamber pressure P c2 and a second back pressure P b2 , wherein P c2 and P b2 are higher than P c1 and P b1 , respectively, P b2 is greater than or equal to 0.5 Torr, and wherein P c2 and P b2 give rise to a pressure differential, P b2 −P c2 , which is maintained at less than +2 Torr.

4. A method according to claim 3 in which the pressure differentials P b1 −P c1 and P b2 −P c2 are each maintained at less than +1 Torr.

5. A method according to claim 3 in which the pressure differentials P b1 −P c1 and P b2 −P c2 are each maintained in the range −0.5 to +0.5 Torr.

6. A method according to claim 3 in which during step iii) the pressure differential P b2 −P c2 is maintained at about 0 Torr.

7. A method according to claim 6 in which during step iii) the chamber is in fluid communication with the back region so that P b2 is substantially equal to P c2 .

8. A method according to claim 3 in which during step ii) the pressure differential P b1 −P c1 is maintained at about 0 Torr.

9. A method according to claim 8 in which during step ii) the chamber is in fluid communication with the back region so that P b1 is substantially equal to P c1 .

10. A method according to claim 3 in which P c2 is in the range 0.5 to 20 Torr, preferably about 1 Torr.

11. A method according to claim 3 in which the workpiece is clamped in place by the workpiece support.

12. A method according to claim 11 in which the workpiece support includes an electrostatic chuck.

13. A method according to claim 12 in which the workpiece is clamped by the electrostatic chuck.

14. A method according to claim 3 in which the processing step is a PVD (physical vapour deposition) process.

15. A method according to claim 3 in which the processing step is a metal sputtering process.

16. A method according to claim 3 in which the semiconductor workpiece is a semiconductor wafer.

17. A method according to claim 16 in which the semiconductor wafer is a thinned, warped, damaged, taped or insulative wafer.

18. A method according to claim 3 in which the semiconductor workpiece is processed to produce an integrated circuit.

19. A semiconductor processing apparatus including: a chamber; a workpiece support positioned in the chamber; a gas supply and pumping arrangement for providing a desired chamber gas pressure in the chamber and a desired back gas pressure in a back region which, in use, is in fluid communication with a rear surface of a semiconductor workpiece; and a control arrangement configured to control the semiconductor processing apparatus, including the gas supply and pumping arrangement, to perform a method according to claim 3 .