IP Library Granted Patent US 7,330,367
Granted Patent B2
US 7,330,367 · App. 11/081,652 · Granted Feb 12, 2008

Stacked 1T-

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Quick Facts
Patent No.
US 7,330,367
App. No.
11/081,652
Granted
Feb 12, 2008
Kind
B2
Abstract

This invention relates to MRAM technology and new variations on MRAM array architecture to incorporate certain advantages from both cross-point and 1T-1MTJ architectures. The fast read-time and higher signal-to-noise ratio of the 1T-1MTJ architecture and the higher packing density of the cross-point architecture are both exploited by combining certain characteristics of these layouts. A single access transistor 16 is used to read multiple MRAM cells, which can be stacked vertically above one another in a plurality of MRAM array layers arranged in a “Z” axis direction.

Claims (23)

1. A method of reading a magnetic memory, comprising:

selecting a common line associated with a respective magnetic bit of a plurality of magnetic bits, wherein each one of said plurality of magnetic bits is in a respective plane of magnetic bits and is associated with a respective sense line;

selecting a wordline of an access transistor, said access transistor being electrically coupled to each said respective sense line; and

sensing a resistance state of said respective magnetic bit associated with said common line at a bit line coupled to said access transistor,

wherein said respective magnetic bit of said plurality of magnetic bits has a read address consisting of an X, Y, and Z coordinate, where, X, Y and Z are axes in three dimensions and correspond to directions of the common line, the wordline and the bit line.

2. The method of claim 1 , wherein said access transistor is electrically coupled to each said respective sense line by a sense line interconnect.

3. The method of claim 2 , wherein said sense line interconnect connects a stack of the plurality of magnetic bits over a substrate.

4. The method of claim 3 , wherein said common line connects multiple magnetic bits in the Y dimension and said sense line interconnect connects magnetic bits of said plurality of magnetic bits in the Z dimension.

5. A method of reading a memory cell, comprising selecting a first memory cell from a three dimensional memory array having a plurality of memory planes, wherein said first memory cell of a first memory plane is in electrical communication with a read-dedicated sense line interconnect, which electrically connects said first memory cell with at least one second memory cell of a second memory plane, and connecting said sense line interconnect and said first and second memory cells with a read circuit.

6. The method of claim 5 , wherein said three dimensional memory array comprises a plurality of stacked planes of memory cells.

7. The method of claim 6 , wherein said first memory cell and each of said second memory cells are in different planes of said array.

8. The method of claim 5 , wherein said first memory cell is addressed for reading by turning on a wordline and a common line.

9. The method of claim 5 , wherein said first memory cell is an MRAM cell.

10. A method of reading memory stored in a resistive memory cell, comprising:

selecting a common line associated with a respective resistive memory cell, wherein the resistive memory cell is associated with a respective sense line;

selecting a wordline of an access transistor, said access transistor being electrically coupled to the sense line; and

sensing a resistance state of the resistive memory cell associated with the common line at a bit line coupled to the access transistor,

wherein the resistive memory cell has a read address consisting of an X, Y, and Z coordinate, where X, Y and Z are axes in three dimensions and correspond to directions of the common line, the wordline and the bit line.

11. The method of claim 10 , wherein said selecting a bit line designates one of said X, Y, and Z coordinates of said address of the resistive memory cell.

12. The method of claim 11 , wherein said selecting a wordline designates another of the X, Y, and Z coordinates.

13. The method of claim 12 , wherein said selecting a common line designates a third one of the X, Y, and Z coordinates.

14. The method of claim 10 , wherein the resistive memory cell is arranged in a planar array of resistive memory cells.

15. The method of claim 14 , wherein the planar array of resistive memory cells is arranged in a stack of a plurality of planar arrays of resistive memory cells.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2016
From: MICRON TECHNOLOGY, INC
To: OVONYX MEMORY TECHNOLOGY, LLC
Reel/Frame 039974/0496 →