IP Library Granted Patent US 7,034,343
Granted Patent B1
US 7,034,343 · App. 11/085,534 · Granted Apr 25, 2006

Dipolar side-emitting LED lens and LED module incorporating the same

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Quick Facts
Patent No.
US 7,034,343
App. No.
11/085,534
Granted
Apr 25, 2006
Kind
B1
Abstract

The present invention relates to a dipolar LED and a dipolar LED module incorporating the same, in which an upper hemisphere-shaped base houses an LED chip therein and adapted to radiate light from the LED chip to the outside, and a pair of reflecting surfaces placed at opposed top portions of the base in a configuration symmetric about an imaginary vertical plane. The vertical plane passes through the center of the LED chip perpendicularly to a light-emitting surface of the LED chip. The reflecting surfaces are extended upward away from the top portions of the base to reflect light from the LED chip away from the imaginary vertical plane. A pair of radiating surfaces are placed outside the reflecting surfaces, respectively, to radiate light from the reflecting surfaces to the outside. In this way, light emission from the LED chip can be concentrated in both lateral directions.

Claims (30)

1. A dipolar Light Emitting Diode (LED) lens comprising:

an upper hemisphere-shaped base housing an LED chip therein and adapted to radiate light from the LED chip to the outside;

a pair of symmetric reflecting surfaces, each reflecting surface having a proximal end placed on top of the base and a distal end extended upward and away from the base, with the proximal ends of the reflecting surfaces meeting each other in the form of a joint line on the top of the base, forming a V-shaped valley extended along the joint line between the reflecting surfaces, whereby light from the LED chip is reflected by the reflecting surfaces in a dipolar pattern symmetric about the joint line; and

a pair of symmetric radiating surfaces placed outside the reflecting surfaces, respectively, to radiate light from the reflecting surfaces to the outside, thereby forming a peanut-shaped light radiation pattern.

2. The dipolar LED lens according to claim 1 , further comprising triangular side surfaces confined by the reflecting surfaces, the radiating surfaces and the base top portions.

3. The dipolar LED lens according to claim 1 , wherein the reflecting surfaces are curved downward.

4. The dipolar LED lens according to claim 1 , wherein the reflecting surfaces are curved upward.

5. The dipolar LED lens according to claim 1 , wherein the reflecting surfaces are planar.

6. The dipolar LED lens according to claim 1 , wherein the reflecting surfaces are widened as extending away from the base top portions.

7. The dipolar LED lens according to claim 1 , wherein the base has a hemispheric space formed in a lower part thereof, the space being opened downward at a uniform curvature.

8. A dipolar Light Emitting Diode (LED) module comprising:

an LED chip;

a board mounted with the LED chip;

a power-connecting unit for electrically connecting the LED chip with an external power source; and

an LED lens for sealing the LED chip therein and radiating light from the LED chip to the outside, wherein the LED lens includes:

an upper hemisphere-shaped base housing the LED chip therein and adapted to radiate light from the LED chip to the outside;

a pair of symmetric reflecting surfaces, each reflecting surface having a proximal end placed on top of the base and a distal end extended upward and away from of the base, with the proximal ends of the reflecting surfaces meeting each other in the form of a joint line on the top of the base, forming a V-shaped valley extended along the joint line between the reflecting surfaces, whereby light from the LED chip is reflected by the reflecting surfaces in a dipolar pattern symmetric about the joint line; and

a pair of symmetric radiating surfaces placed outside the reflecting surfaces, respectively, to radiate light from the reflecting surfaces to the outside, thereby forming a peanut-shaped light radiation pattern.

9. The dipolar LED module according to claim 8 , wherein the base has a hemispheric space formed in a lower part thereof, the space being opened downward at a uniform curvature.

10. The dipolar LED module according to claim 9 , further comprising an encapsulant housing the LED chip within the space of the base and integrally bonded with the LED chip, the encapsulant having a curvature matching that of the space.

11. The dipolar LED module according to claim 10 , wherein the encapsulant comprises polymer having a refractive index of about 1.45 to 1.65.

12. The dipolar LED module according to claim 11 , wherein the encapsulant comprises nano-sized particles uniformly dispersed through the polymer, the nano-sized particles having a refractive index of about 2.2 to 3.5.

13. The dipolar LED module according to claim 10 , wherein the lens is provided as a separate piece from the encapsulant.

14. The dipolar LED module according to claim 8 , further comprising an encapsulant placed inside the lens to house the LED chip and integrally bonded with the LED chip.

15. The dipolar LED module according to claim 14 , wherein the encapsulant comprises polymer having a refractive index of about 1.45 to 1.65.

16. The dipolar LED module according to claim 15 , wherein the encapsulant comprises nano-sized particles uniformly dispersed through the polymer, the nano-sized particles having a refractive index of about 2.2 to 3.5.

17. The dipolar LED module according to claim 8 , wherein the LED lens further includes triangular side surfaces confined by the reflecting surfaces, the radiating surfaces and the base top portions.

18. The dipolar LED module according to claim 17 , wherein the base has a hemispheric space formed in a lower part thereof, the space being opened downward at a uniform curvature.

19. The dipolar LED module according to claim 18 , further comprising an encapsulant housing the LED chip within the space of the base and integrally bonded with the LED chip, the encapsulant having a curvature matching that of the space.

20. The dipolar LED module according to claim 17 , further comprising an encapsulant placed inside the lens to house the LED chip and integrally bonded with the LED chip.

Assignments (2)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →