Nonvolatile semiconductor memory device that erases stored data after a predetermined time period without the use of a timer circuit
View Patent ↗A nonvolatile semiconductor memory device is characterized by including a memory cell to store data, a first reference cell, a check circuit to check a threshold of the first reference cell, and an erase circuit to erase the data of the memory cell in response to detection by the check circuit that the threshold of the first reference cell is smaller than or substantially equal to a predetermined fixed value.
1. A nonvolatile semiconductor memory device, characterized by comprising:
a memory cell to store data;
a first reference cell;
a second unwritten reference cell;
a check circuit to check a threshold of said first reference cell by comparing a cell current of said first reference cell with a cell current of the second unwritten reference cell; and
an erase circuit to erase the data of said memory cell in response to detection by said check circuit that the threshold of said first reference cell is smaller than or substantially equal to a predetermined fixed value.
2. The nonvolatile semiconductor memory device as claimed in claim 1 , wherein the nonvolatile semiconductor memory device is housed on a terminal selected from the group consisting of a personal computer, a minicomputer, a main frame computer, a microcomputer, a hand held device, and a telephonic device.
3. The nonvolatile semiconductor memory device as claimed in claim 1 , characterized by further comprising a control circuit configured to set the threshold of said first reference cell at a value larger than the predetermined fixed value by performing an operation for programming said first reference cell in conjunction with an operation for writing the data to said memory cell.
4. The nonvolatile semiconductor memory device as claimed in claim 3 , characterized in that said control circuit adjusts an amount of electric current programmed to said first reference cell in response to an input from an exterior of said nonvolatile semiconductor memory device.
5. The nonvolatile semiconductor memory device as claimed in claim 1 , characterized in that said first reference cell includes: a substrate; a tunnel oxide film formed on said substrate; and a floating gate formed on said tunnel oxide film, wherein a thickness of said tunnel oxide film is 5.0 nm or less.
6. The nonvolatile semiconductor memory device as claimed in claim 5 , characterized in that said memory cell includes: a tunnel oxide film of said memory cell formed on said substrate; and a floating gate formed on said tunnel oxide film of said memory cell, wherein a thickness of said tunnel oxide film of said memory cell is 5.0 nm or less.
7. The nonvolatile semiconductor memory device as claimed in claim 1 , further comprising:
an internal clock that specifies predetermined time intervals at which said check circuit checks the threshold of said first reference cell.
8. The nonvolatile semiconductor memory device as claimed in claim 1 , characterized in that said check circuit checks the threshold of said first reference cell in response to power-on of said nonvolatile semiconductor memory device.
9. The nonvolatile semiconductor memory device as claimed in claim 1 , characterized by further comprising
a control circuit configured to prohibit an erase operation and a write operation with respect to said memory cell while the threshold of said first reference cell is larger than the predetermined fixed value.
10. The nonvolatile semiconductor memory device as claimed in claim 1 , characterized by comprising a plurality of memory units obtained by dividing an array of more than one said memory cell, said first reference cell being individually provided for a corresponding one of said memory units.
11. A nonvolatile semiconductor memory device, comprising:
a memory cell to store data;
a first reference cell;
a check circuit to check a threshold of said first reference cell by comparing a cell current of the first reference cell with a cell current of a second unwritten reference cell; and
an erase circuit to erase the data of said memory cell in response to detection by said check circuit that the threshold of said first reference cell is smaller than or substantially equal to a predetermined fixed value; and
an internal clock that specifies predetermined time intervals at which said check circuit checks the threshold of said first reference cell.
12. The nonvolatile semiconductor memory device as claimed in claim 11 , characterized by further comprising a control circuit configured to set the threshold of said first reference cell at a value larger than the predetermined fixed value by performing an operation for programming said first reference cell in conjunction with an operation for writing the data to said memory cell.
13. The nonvolatile semiconductor memory device as claimed in claim 12 , characterized in that said control circuit adjusts an amount of electric current programmed to said first reference cell in response to an input from an exterior of said nonvolatile semiconductor memory device.
14. The nonvolatile semiconductor memory device as claimed in claim 11 , characterized in that said first reference cell includes: a substrate; a tunnel oxide film formed on said substrate; and a floating gate formed on said tunnel oxide film, wherein a thickness of said tunnel oxide film is 5.0 nm or less.
15. The nonvolatile semiconductor memory device as claimed in claim 11 , characterized by comprising a plurality of memory units obtained by dividing an array of more than one said memory cell, said first reference cell being individually provided for a corresponding one of said memory units.
16. A nonvolatile semiconductor memory device, comprising:
a memory cell to store data;
a first reference cell;
a check circuit to check a threshold of said first reference cell by comparing a cell current of the first reference cell with a cell current of a second unwritten reference cell; and
an erase circuit to erase the data of said memory cell in response to detection by said check circuit that the threshold of said first reference cell is smaller than or substantially equal to a predetermined fixed value; and
a control circuit configured to prohibit an erase operation and a write operation with respect to said memory cell while the threshold of said first reference cell is larger than the predetermined fixed value.
17. The nonvolatile semiconductor memory device as claimed in claim 16 , characterized by further comprising a control circuit configured to set the threshold of said first reference cell at a value larger than the predetermined fixed value by performing an operation for programming said first reference cell in conjunction with an operation for writing the data to said memory cell.
18. The nonvolatile semiconductor memory device as claimed in claim 17 , characterized in that said control circuit adjusts an amount of electric current programmed to said first reference cell in response to an input from an exterior of said nonvolatile semiconductor memory device.
19. The nonvolatile semiconductor memory device as claimed in claim 16 , characterized in that said first reference cell includes: a substrate; a tunnel oxide film formed on said substrate; and a floating gate formed on said tunnel oxide film, wherein a thickness of said tunnel oxide film is 5.0 nm or less.
20. The nonvolatile semiconductor memory device as claimed in claim 16 , further comprising:
an internal clock that specifies predetermined time intervals at which said check circuit checks the threshold of said first reference cell.
21. The nonvolatile semiconductor memory device as claimed in claim 16 , characterized by comprising a plurality of memory units obtained by dividing an array of more than one said memory cell, said first reference cell being individually provided for a corresponding one of said memory units.