Curable adhesive composition, adhesive kit and method of adhering substrates
A curable adhesive composition kit and method of adhering substrates is provided having three basic adhesives and up to three additional optional adhesives. The basic adhesives include: at least one curable silicone end group-containing adhesive; at least one curable cyanoacrylate adhesive, and at least one curable epoxy adhesive. The optional adhesives can be one or more of the following: contact adhesive, urethane adhesive, polyvinylacetate adhesive, and pressure sensitive adhesive. The kit system also can have a selection guide for the adhesives in the system based on substrate types or substrate types and use conditions. Optionally a guide for using the adhesives in repairing adherends can be included in the kit. Also optionally the selection guide and/or the repair guide can be in an interactive program on a web site on a computer network such as the internet.
1. An adhesives kit comprising:
a cyanoacrylate adhesive;
a second adhesive formulation comprising an epoxy curing agent two component adhesive that cures after the two components are activated by mixing together or heating; and
a third adhesive formulation comprising a modified silicone-containing adhesive comprising:
a polymer or copolymer having one or more reactive silicon end groups;
from about 0.01 to about 50 percent by weight of a blend of clear fillers that will not substantially interfere with the production of clear adhesive comprising i) fumed silica having a surface area of less than 150 m 2 /gram, and ii) clear filler selected from the group consisting of glass microbeads, glass fibers, clear polymer fibers, clear polymer microbeads, clear polymer powders, and combinations thereof having a surface area from 75 to less than 250 m 2 /gram; and
from about 0.01 to about 10 percent by weight of a dehydrating agent;
wherein the modified silicon-containing adhesive has a viscosity from about 1,000 to about 200,000 centipoise and a glass transition temperature of less than −20° C., and a service temperature range of about −60° C. to about 160° C.
2. The adhesive kit of claim 1 , further comprising an adhesive selection guide where the guide comprises instructions selected from the group consisting of substrate matching, repair method, adhesive use factors and combinations thereof.
3. The kit of claim 2 , wherein the adhesive selection guide comprises a matrix chart comprising:
more than one substrate reference aligned along a first axis and a second axis of the matrix; and
more than one symbol of adhesive, wherein each symbol is located at an intersection defined by a substrate reference aligned along the first axis and a substrate reference aligned along the second axis;
wherein a symbol identifies an adhesive that bonds two substrates represented by the substrate reference aligned along the first axis and substrate reference aligned along the second axis.
4. The kit of claim 3 , wherein the symbol at the intersection of the substrate references is selected from the group consisting of numbers, letters, geometric shapes, series of shapes, colors and combinations thereof.
5. The kit of claim 2 , wherein adhesive selection guide comprises an internet web address connecting to a web site having the matrix chart and optionally at least one utilization factor.
6. The kit of claim 5 , wherein the web site is an interactive internet web site that receives user input information on the matrix chart.
7. The kit of claim 1 , wherein the modified silicone-containing adhesive comprises a polymer backbone comprising polyalkyl oxide.
8. The kit of claim 7 , wherein the one or more reactive silicon end groups comprise alkoxysilane.
9. The kit of claim 7 , wherein:
the polyalkyl oxide backbone comprises polyether; and
the one or more reactive silicon end groups comprise alkoxysilane.
10. The kit of claim 7 , wherein:
the polyalkyl oxide backbone comprises polyether; and
the one or more reactive silicon end groups comprise methyldiethoxysilane.
11. The kit of claim 7 , wherein:
the polyalkyl oxide backbone comprises polyether; and
the one or more reactive silicon end groups comprise triethoxysilane.
12. The kit of claim 1 , wherein the modified silicone-containing adhesive comprises one or more reactive silicone end groups selected from the group consisting of triethoxysilane, methyldiethoxysilane, trisilanol, and combinations thereof.