System and apparatus for fixing a substrate with a heat transferring device
View Patent ↗A system for fixing a substrate with a heat transferring device in an assembled orientation; the system comprising: a substantially rod-shaped positioning member having a length generally symmetrically oriented about an axis and a generally constant lateral expanse substantially perpendicular with said axis substantially along said length; said positioning member interferingly fitting within at least one of a first aperture in said substrate and a second aperture in said heat transferring device to maintain a predetermined separation between said substrate and said heat transferring device in said assembled orientation.
1. A system for fixing a substrate with a heat transferring device in an assembled orientation; the system comprising: a substantially rod-shaped positioning member having a length generally symmetrically oriented about an axis and a generally constant lateral expanse substantially perpendicular with said axis substantially along said length; said positioning member generally transaxially interferingly fitting within at least one of a first aperture in said substrate and a second aperture in said heat transferring device to maintain a predetermined separation between said substrate and said heat transferring device in said assembled orientation.
2. A system for fixing a substrate with a heat transferring device in an assembled orientation as recited in claim 1 wherein said positioning member further comprises a first interference structure integrally formed at a first end for effecting said interferingly fitting with said substrate.
3. A system for fixing a substrate with a heat transferring device in an assembled orientation as recited in claim 1 wherein said positioning member further comprises a second interference structure integrally formed at a second end for effecting said interferingly fitting with said heat transferring device.
4. A system for fixing a substrate with a heat transferring device in an assembled orientation as recited in claim 1 wherein said positioning member further comprises a nail head termination structure at a second end for resisting separating said substrate from said heat transferring device; said heat transferring device being situated between said nail head termination structure and said substrate in said assembled orientation.
5. A system for fixing a substrate with a heat transferring device in an assembled orientation as recited in claim 2 wherein said positioning member further comprises a second interference structure integrally formed at a second end for effecting said interferingly fitting with said heat transferring device.
6. A system for fixing a substrate with a heat transferring device in an assembled orientation as recited in claim 2 wherein said positioning member further comprises a nail head termination structure at a second end for resisting separating said substrate from said heat transferring device; said heat transferring device being situated between said nail head termination structure and said substrate in said assembled orientation.
7. A system for fixing a substrate with a heat transferring device in an assembled orientation as recited in claim 3 wherein said positioning member further comprises a nail head termination structure at a second end for resisting separating said substrate from said heat transferring device; said heat transferring device being situated between said nail head termination structure and said substrate in said assembled orientation.
8. A system for fixing a substrate with a heat transferring device in an assembled orientation; the system comprising: at least one substantially rigid positioning member having a length generally symmetrically oriented about an axis and a generally constant lateral expanse substantially perpendicular with said axis substantially along said length; said positioning member being received within at least one first aperture in said substrate and received within at least one second aperture in said heat transferring device; said at least one positioning member and said at least one first aperture being configured to cooperatively establish a generally transaxial interference fitting relation; said interference fitting relation maintaining a predetermined depth of reception of each respective positioning member of said at least one positioning member within each respective first aperture of said at least one first aperture.
9. A system for fixing a substrate with a heat transferring device in an assembled orientation as recited in claim 8 wherein said positioning member further comprises a first interference structure integrally formed at a first end for effecting said interferingly fitting with said substrate.
10. A system for fixing a substrate with a heat transferring device in an assembled orientation as recited in claim 8 wherein said positioning member further comprises a second interference structure integrally formed at a second end for effecting said interferingly fining with said heat transferring device.
11. A system for fixing a substrate with a heat transferring device in an assembled orientation as recited in claim 8 wherein said positioning member further comprises a nail head termination structure at a second end for resisting separating said substrate from said heat transferring device; said heat transferring device being situated between said nail head termination structure and said substrate in said assembled orientation.
12. A system for fixing a substrate with a heat transferring device in an assembled orientation as recited in claim 9 wherein said positioning member further comprises a second interference structure integrally formed at a second end for effecting said interferingly fitting with said heat transferring device.
13. A system for fixing a substrate with a heat transferring device in an assembled orientation as recited in claim 9 wherein said positioning member further comprises a nail head termination structure at a second end for resisting separating said substrate from said heat transferring device; said heat transferring device being situated between said nail head termination structure and said substrate in said assembled orientation.
14. A system for fixing a substrate with a heat transferring device in an assembled orientation as recited in claim 10 wherein said positioning member further comprises a nail head termination structure at a second end for resisting separating said substrate from said heat transferring device; said heat transferring device being situated between said nail head termination structure and said substrate in said assembled orientation.
15. An apparatus for fixing a substrate a predetermined distance from a heat transferring device in an assembled orientation; said substrate having a first aperture with a first internal structure substantially oriented about a first axis; said first internal structure having a first transaxial minimum dimension substantially perpendicular with said first axis; said heat transferring device having a second aperture with a second internal structure substantially oriented about a second axis; said second internal structure having a second transaxial minimum dimension substantially perpendicular with said second axis; the apparatus comprising: a generally rod-shaped stand-off member generally symmetrically oriented about a longitudinal axis; said stand-off member having a first engagement length having a first trans-axial engagement dimension substantially perpendicular with said longitudinal axis; said first trans-axial engagement dimension cooperating with said first trans-axial minimum dimension to effect a first interference fit to establish a first depth of insertion of said stand-off member within said first aperture; said stand-off member having a second engagement length having a second trans-axial engagement dimension substantially perpendicular with said longitudinal; said second trans-axial engagement dimension cooperating with said second trans-axial minimum dimension to effect a second interference fit to establish a second depth of insertion of said stand-off member within said second aperture; said stand-off member having an intermediate length between said first engagement length and said second engagement length; said intermediate length having an intermediate transaxial dimension substantially perpendicular with said longitudinal axis; said intermediate transaxial dimension being generally equal with said first trans-axial engagement dimension; said first depth of insertion and said second depth of insertion cooperating with said intermediate length to establish said predetermined distance in said assembled orientation.
16. An apparatus for fixing a substrate a predetermined distance from a heat transferring device in an assembled orientation as recited in claim 15 wherein said first engagement length includes an integrally formed first interference structure for effecting said first interference fit.
17. An apparatus for fixing a substrate a predetermined distance from a heat transferring device in an assembled orientation as recited in claim 15 wherein said second engagement length includes an integrally formed second interference structure for effecting said second interference fit.
18. An apparatus for fixing a substrate a predetermined distance from a heat transferring device in an assembled orientation as recited in claim 15 wherein said second engagement length terminates in a nail head structure for resisting separating said substrate from said heat transferring device; said heat transferring device being situated between said nail head structure and said substrate in said assembled orientation.
19. An apparatus for fixing a substrate a predetermined distance from a heat transferring device in an assembled orientation as recited in claim 16 wherein said second engagement length includes an integrally formed second interference structure for effecting said second interference fit.
20. An apparatus for fixing a substrate a predetermined distance from a heat transferring device in an assembled orientation as recited in claim 16 wherein said second engagement length terminates in a nail head structure for resisting separating said substrate from said heat transferring device; said heat transferring device being situated between said nail head structure and said substrate in said assembled orientation.