Semiconductor light-emitting device with improved light extraction efficiency
View Patent ↗The present invention provides a semiconductor light-emitting device. The light-emitting device comprises a first conductive clad layer, an active layer, and a second conductive clad layer sequentially formed on a substrate. In the light-emitting device, the substrate has one or more side patterns formed on an upper surface thereof while being joined to one or more edges of the upper surface. The side patterns consist of protrusions or depressions so as to scatter or diffract light to an upper portion or a lower portion of the light-emitting device.
1. A semiconductor light-emitting device, comprising:
a substrate used in growing a semiconductor crystal;
a first conductive clad layer, an active layer, and a second conductive clad layer sequentially grown on an upper surface of the substrate covering entire area between opposing side surfaces of the substrate,
wherein the substrate has one side pattern continuously formed along all edges of the upper surface thereof, the side pattern consisting of a protrusion or depression so as to scatter or diffract light, directed to side surfaces of the light-emitting device, to an upper portion or a lower portion of the light-emitting device, and the upper surface of the substrate has no internal pattern and
the side pattern consists of protrusion having a surface slanted inwardly on the upper surface of the substrate.
2. The light-emitting device as set forth in claim 1 , wherein the substrate has a rectangular-shaped upper surface, and the side pattern is formed along four edges of the upper surface of the substrate.
3. The light-emitting device as set forth in claim 1 , wherein the protrusion has an upper surface comprising the same crystal plane as that of the upper surface of the substrate.
4. The light-emitting device as set forth in claim 1 , wherein the first and second conductive clad layers, and the active layer are nitride semiconductor layers, respectively.
5. The light-emitting device as set forth in claim 1 , wherein the substrate is selected from a sapphire substrate, a SiC substrate, a Si substrate and a GaAs substrate.