Granted Patent B2

US 7,279,259 · App. 11/102,689 · Granted Oct 9, 2007

Abstract

Claims (40)

1. A pattern data correcting method for making a correction to pattern data affected by a proximity effect when a pattern is formed on a photomask or wafer according to design data for a semiconductor device, comprising the steps of:

detecting, according to said design data, a space portion on said photomask or wafer and having a specified size occurring between first and second patterns facing each other;

producing pattern data corresponding to an assist pattern that fills said space portion;

detecting, on a third pattern near to said assist pattern, an edge to be corrected in a position out of framing portions of said third pattern and opposite to and parallel with an edge of said assist pattern, said edge of said assist pattern extending in a direction between said first and second patterns facing each other;

making a correction to the detected edge, said correction being independent of a correction made to an other edge of said third pattern; and

removing said assist pattern.

2. The pattern data correcting method according to claim 1 , wherein said pattern data corresponding to said assist pattern is defined by a layer or a variable different from that for said design data.

3. The pattern data correcting method according to claim 1 , wherein said space portion is a region between said first and second patterns, which face each other in a T-shaped or an I-shaped manner.

4. The pattern data correcting method according to claim 1 , wherein said edge to be corrected is detected by extracting a region in a position opposite to said edge of said assist pattern and having a length the same as that of said edge of said assist pattern.

5. The pattern data correcting method according to claim 1 , wherein said edge to be corrected is detected by moving said edge of said assist pattern so as to come in contact with said edge to be corrected and extracting a region of said edge of said assist pattern which is in contact with said edge to be corrected to detect said edge to be corrected.

6. The pattern data correcting method according to claim 1 , wherein said edge to be corrected is detected by extending two lines out from said assist pattern, said two lines being perpendicular to said edge of said assist pattern extending in direction between said first and second patterns and by extracting a region formed between two points where said two lines contact with said third pattern.

7. The pattern data correcting method according to claim 6 , wherein a correction value for said edge to be corrected is determined according to an angle formed between one of said two lines with said edge to be corrected.

8. The pattern data correcting method according to claim 1 , further comprising a step of forming a second assist pattern that fills a space between said assist pattern and said third pattern and located in parallel with and near to said assist pattern, wherein said edge to be corrected is detected by extracting a region where said second assist pattern is in contact with said third pattern.

9. The pattern data correcting method according to claim 1 , wherein processing in each step is performed on design data having been corrected according to predetermined rules.

10. The pattern data correcting method according to claim 9 , wherein said predetermined rules are correcting rules according to which a correction value is determined according to a line dimension of said third pattern and to a space dimension between said patterns.

11. A pattern data correcting method for making a correction to pattern data affected by a proximity effect when a pattern is formed on a photomask or wafer according to design data for a semiconductor device, comprising the steps of:

detecting an isolated edge region out of framing portions of a first pattern, in which a space width occurring between a second pattern and a third pattern facing each other and said first pattern exists within a specified distance;

producing pattern data corresponding to an assist pattern that fills a space portion between said second and third patterns;

extracting an edge of said assist pattern extending between said second and third patterns facing each other in a second direction;

making a correction to data of said isolated edge according to a length of said edge of said assist pattern and an interval between said assist pattern and said isolated edge; and

removing said assist pattern.

12. The pattern data correcting method according to claim 11 , wherein said pattern data corresponding to said assist pattern is defined by a layer or a variable which is different from that for said design data.

13. The pattern data correcting method according to claim 11 , wherein processing in each step is performed on design data having been corrected according to predetermined rules.

14. The pattern data correcting method according to claim 13 , wherein said predetermined rules are correcting rules according to which a correction value is determined according to a line dimension of said first pattern and to a space dimension between said second and third patterns.

15. A method for manufacturing a semiconductor device comprising:

forming a photomask by

detecting, according to said design data, a space portion on said photomask or wafer and having a specified size occurring between first and second patterns facing each other,

producing pattern data corresponding to an assist pattern that fills said space portion,

detecting, on a third pattern near to said assist pattern, an edge to be corrected in a position out of framing portions of said third pattern and opposite to and parallel with an edge of said assist pattern, said edge of said assist pattern extending in a direction between said first and second patterns facing each other,

making a correction to the detected edge to be corrected, said correction being independent of a correction made to an other edgeof said third pattern, and

removing said assist pattern; and

performing an exposure by using said photomask.

16. A method for manufacturing a semiconductor device comprising:

forming a photomask by

detecting an isolated edge region out of framing portions of a first pattern, in which a space width occurring between a second pattern and a third pattern facing each other and said first pattern exists within a specified distance,

producing pattern data corresponding to an assist pattern that fills a space portion between said second and third patterns,

extracting an edge of said assist pattern extending between said second and third patterns facing each other in a second direction,

making a correction to data of said isolated edge according to a length of said edge of said assist pattern and an interval between said assist pattern and said isolated edge, and

removing said assist pattern; and

performing an exposure by using said photomask.

Assignments (9)