Heating phase change material
View Patent ↗A phase change memory may be formed of two vertically spaced layers of phase change material. An intervening dielectric may space the layers from one another along a substantial portion of their lateral extent. An opening may be provided in the intervening dielectric to allow the phase change layers to approach one another more closely. As a result, current density may be increased at this location, producing heat
1. A phase change memory comprising:
a first chalcogenide material;
a second chalcogenide material, said first and second chalcogenide materials being spaced from one another by an intervening layer and a resistive layer, wherein the resistive layer is formed of a third chalcogenide material;
an opening through said intervening layer to reduce the spacing between said first and second chalcogenide materials; and
wherein said first and third chalcogenide materials are in physical contact at said opening and said second and third chalcogenide materials are in physical contact at said opening.
2. The memory of claim 1 wherein said first and second chalcogenide materials are different chalcogenide materials.
3. The memory of claim 2 wherein said first chalcogenide material is part of a select device and said second chalcogenide material is part of a memory element.
4. The memory of claim 1 including a first and second contact, said first contact in contact with said first chalcogenide material and said second contact in contact with said second chalcogenide material.
5. The memory of claim 4 wherein said contacts are spaced away from said opening along the length of said first and second chalcogenide materials.
6. The memory of claim 5 wherein said first and second contacts are substantially aligned with one another.
7. The memory of claim 1 wherein said resistive layer is more resistive than said first and second chalcogenide materials.
8. The memory of claim 1 wherein said intervening layer is formed directly on said first chalcogenide material.
9. The memory of claim 1 wherein said third chalcogenide material is more resistive than either of said first or second chalcogenide materials.
10. The memory of claim 1 wherein said third chalcogenide material is positioned over an insulating layer.
11. The memory of claim 10 wherein said third chalcogenide material extends into said opening in said intervening layer.
12. The memory of claim 11 wherein said third chalcogenide material is in contact with both of said first and second chalcogenide materials.
13. The memory of claim 1 wherein said resistive layer is sized such that when a cell including the second chalcogenide material is programmed, the resistive layer breaks down in an area within the opening.
14. A phase change memory comprising:
a first chalcogenide material;
a second chalcogenide material, said first and second chalcogenide materials being spaced from one another by an intervening layer;
a resistive layer further separating the first and second chalcogenide materials; and
an opening through said intervening layer so that said first and second chalcogenide materials are closer to one another at said opening, the resistive layer separating the first and second chalcogenide materials in the opening.
15. The memory of claim 14 wherein said first and second chalcogenide materials are different chalcogenide materials.
16. The memory of claim 15 wherein said first chalcogenide material is part of a select device and said second chalcogenide material is part of a memory element.
17. The memory of claim 14 including a first and second contact, said first contact in contact with said first chalcogenide material and said second contact in contact with said second chalcogenide material.
18. The memory of claim 17 wherein said contacts are spaced away from said opening along the length of said first and second chalcogenide materials.
19. The memory of claim 18 wherein said first and second contacts are substantially aligned with one another.
20. The memory of claim 14 wherein said resistive layer is more resistive than said first and second chalcogenide materials.
21. The memory of claim 20 wherein said resistive layer is formed of a third chalcogenide material.
22. The memory of claim 14 wherein said intervening layer is formed directly on said first chalcogenide material.
23. The memory of claim 14 wherein said resistive layer is sized such that when a cell including the second chalcogenide material is programmed, the resistive layer breaks down in an area within the opening.