IP Library Granted Patent US 7,358,169
Granted Patent B2
US 7,358,169 · App. 11/105,262 · Granted Apr 15, 2008

Laser-assisted deposition

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Quick Facts
Patent No.
US 7,358,169
App. No.
11/105,262
Granted
Apr 15, 2008
Kind
B2
Abstract

A method is provided for depositing a patterning material onto an optically transparent substrate by the use of a laser beam. A solid layer of a patterning material is placed adjacent to a receiving surface of the substrate. A laser beam is directed at an incident angle between 0 and 90° relative to the receiving surface. The laser beam is transmitted through the substrate and onto the solid layer to cause patterning material from the solid layer to deposit onto the receiving surface of the substrate.

Claims (15)

1. A method for depositing a patterning material onto an optically transparent substrate, wherein the optically transparent substrate includes a back surface and a receiving surface, said method comprising:

placing a solid layer of patterning material substantially adjacent to the receiving surface of the substrate, wherein the solid layer includes a first surface facing the receiving surface and a second surface facing away from the receiving surface;

directing a focused laser beam at an incident angle between 0 and 90° relative to the receiving surface and through the back surface; and

depositing patterning material from the first surface of the solid layer onto the receiving surface of the optically transparent substrate by transmitting the laser beam through the optically transparent substrate onto the solid layer to cause the patterning material from the first surface of the solid layer to evaporate and become deposited onto the receiving surface.

2. The method of claim 1 , wherein the patterning material comprises a metallic material.

3. The method of claim 1 , wherein the patterning material comprises carbon.

4. The method of claim 1 , wherein the patterning material is a semiconductor.

5. The method of claim 1 , wherein the solid layer is placed at a distance from the receiving surface of the substrate.

6. The method of claim 5 , wherein the distance between the solid layer and the receiving surface is between 0 and 10 mm.

7. The method of claim 1 , wherein the solid layer is in contact with the receiving surface of the substrate.

8. The method of claim 1 , wherein the substrate is moved relative to the focused laser beam so that the patterning material is deposited in a pattern on the receiving surface.

9. The method of claim 1 , wherein the deposition of the patterning material is carried out at ambient atmosphere.

10. The method of claim 1 , wherein the deposited patterning material has a line width that is smaller than the width of the focused laser beam.

11. The method of claim 1 , wherein the solid layer is a free-standing layer without a support.

12. The method of claim 1 , wherein depositing the patterning material further comprises transmitting the laser beam through the optically transparent substrate to cause the second surface of the solid layer to remain intact as the first surface is evaporated.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2011
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; HEWLETT-PACKARD COMPANY
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026198/0139 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2005
From: ZHU, LEI; KHOR, SENG TENG; CHEN, QIONG; ADDINGTON, CARY G.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 016472/0010 →