IP Library Granted Patent US 7,112,475
Granted Patent B2
US 7,112,475 · App. 11/105,381 · Granted Sep 26, 2006

Method of fabricating a thin film transistor with multiple gates using metal induced lateral crystallization

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,112,475
App. No.
11/105,381
Granted
Sep 26, 2006
Kind
B2
Abstract

A thin film transistor with multiple gates using an MILC process which is capable of materializing multiple gates without increasing dimensions and a method thereof. The thin film transistor has a semiconductor layer which is formed on a insulating substrate in a zigzag shape; and a gate electrode which is equipped with one or more slots intersecting with the semiconductor layer, the semiconductor layer includes two or more body parts intersecting with the gate electrode; and one or more connection parts connecting each neighboring body part, wherein a part overlapping the semiconductor layer in the gate electrode acts as a multiple gate, and MILC surfaces are formed at a part which does not intersect with the gate electrode in the semiconductor layer.

Claims (16)

1. A method of fabricating a thin film transistor with multiple gates using the MILC process comprising:

forming a multi-semiconductor layer comprising neighboring polycrystalline silicon films using the MILC process on an insulating substrate;

forming a gate electrode equipped with one or more slots intersecting with the multi-semiconductor layer;

forming contact holes so that each of two edges of the multi-semiconductor layer are exposed;

simultaneously forming source/drain electrodes contacting one exposed side edge of the multi-semiconductor layer; and

forming a link to connect the other exposed side edge of the multi-semiconductor layer with a multi-semiconductor layer to be contacted.

2. The method according to claim 1 , further comprising:

forming a buffer layer;

forming an amorphous silicon layer on the buffer layer;

forming a blocking layer on the amorphous silicon layer;

forming a photosensitive film on the blocking layer;

forming a first pattern layer of the blocking layer using the photosensitive film as a mask;

reflowing the photosensitive film so as to completely cover the patterned blocking layer;

depositing a metal layer;

removing the photosensitive film; and

crystallizing the amorphous silicon film using the MILC process.

Assignments (2)
MERGER Recorded Aug 29, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028868/0387 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2008
From: SAMSUNG SDI CO., LTD.
To: SAMSUNG MOBILE DISPLAY CO., LTD.
Reel/Frame 022010/0001 →