IP Library Granted Patent US 7,113,132
Granted Patent B2
US 7,113,132 · App. 11/108,326 · Granted Sep 26, 2006

Low-loss printed circuit board antenna structure and method of manufacture thereof

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Quick Facts
Patent No.
US 7,113,132
App. No.
11/108,326
Granted
Sep 26, 2006
Kind
B2
Abstract

The present invention provides a method of manufacturing an antenna structure. In one embodiment, the method includes forming an antenna trace on a substrate proximate a ground plane of the substrate. In addition, the method includes creating an insulation region extending through the substrate and located between the antenna trace and the ground plane.

Claims (30)

1. An antenna structure, comprising:

an antenna substrate having a planar surface, said antenna substrate having a predetermined radio frequency loss associated therewith;

a planar antenna trace formed on said planar surface and extending along and adjacent an edge of said planar surface;

a ground plane formed on said antenna substrate, wherein said ground plane is non-overlapping with said planar antenna trace; and

a low-loss region located between said planar antenna trace and said ground plane, said low-loss region having a longitudinal axis extending along only a portion of and adjacent said edge, and having a radio frequency loss less than said predetermined radio frequency loss.

2. The antenna structure recited in claim 1 , wherein said low-loss region is non-overlapping with said planar antenna trace.

3. The antenna structure recited in claim 2 , wherein said ground plane is a planar ground plane and is located on said planar surface and is co-planar with said planar antenna trace.

4. The antenna structure recited in claim 1 further including a plurality of said low-loss regions, wherein each of said low-loss regions is separated by a portion of said substrate and each of said plurality is non-overlapping with said planar antenna trace.

5. The antenna structure recited in claim 1 wherein said low-loss region is selected from a group consisting of:

ABS plastic;

air;

ceramic; and

Teflon.

6. The antenna structure recited in claim 1 wherein said planar antenna trace comprises a first portion that extends in one direction along said edge and a second portion that extends in an opposite direction along said edge.

7. The antenna structure recited in claim 1 wherein said low-loss region is an opening that extends through a thickness of said substrate.

8. A method of manufacturing an antenna structure, comprising:

providing an antenna substrate having a planar surface, said antenna substrate having a predetermined radio frequency loss associated therewith

forming a planar antenna trace on said planar surface along and adjacent an edge of said planar surface,

placing a ground plane on said antenna substrate, wherein said ground plane is non-overlapping with said planar antenna trace; and

creating a low-loss region between said planar antenna trace and said ground plane, said low-loss region having a longitudinal axis extending along only a portion of and adjacent said edge, said low-loss region having a radio frequency loss less than said predetermined radio frequency loss.

9. The method recited in claim 8 , wherein said low-loss region is non-overlapping with said planar antenna trace.

10. The method recited in claim 8 , wherein said ground plane is a planar ground plane formed on said planar surface and co-planar with said planar antenna trace.

11. The method recited in claim 8 wherein said creating includes creating a plurality of low-loss regions, wherein each of said low-loss regions is separated by a portion of said substrate and each of said plurality is non-overlapping with said planar antenna trace.

12. The method recited in claim 8 wherein said creating includes creating a low-loss region selected from a group consisting of:

ABS plastic;

air;

ceramic; and

Teflon.

13. The method recited in claim 8 wherein said forming includes forming first and second portions of said planar antenna trace wherein said first portion extends in one direction along said edge and the second portion extends in an opposite direction along said edge.

14. The method recited in claim 8 wherein said creating said low-loss region comprises forming an opening that extends through a thickness of said substrate.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047196 FRAME: 0097. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035059/0001 →
MERGER Recorded Feb 20, 2015
From: AGERE SYSTEMS INC.
To: AGERE SYSTEMS LLC
Reel/Frame 035058/0895 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →