Apparatus and method for making circuitized substrates in a continuous manner
View Patent ↗Apparatus and method for making circuitized substrates using a continuous roll format in which layers of conductor and dielectric are fed into the apparatus, bonded, and passed on to other nearby work stations in which various processes such as hole formation, circuitization and, finally, segmentation occur. The resulting substrates can then be individually bonded to other, like substrates to form a larger multi-layered substrate with a plurality of conductive thru-holes, conductive and dielectric layers as part thereof.
1. A method of making a plurality of circuitized substrates, said method comprising:
providing a first conductive layer having first and second opposing surfaces;
providing first and second dielectric layers;
bonding said first and second dielectric layers to said first and second opposing surfaces of said first conductive layer respectively, to form a continuous, bonded structure;
forming holes within said continuous, bonded structure in a plurality of patterns such that said holes extend entirely through the thickness of said structure;
providing electrically conductive material within said holes; and
thereafter segmenting said continuous bonded structure to define a plurality of circuitized substrates each having a respective one of said patterns of holes therein, all of said steps being performed while said first conductive layer is in the form of a continuous, solid member.
2. The method of claim 1 wherein said first conductive layer and said first and second dielectric layers are each provided from a respective, individual roll.
3. The method of claim 1 wherein said bonding of said first and second dielectric layers to said first and second opposing surfaces of said first conductive layer is accomplished using a pair of opposed, heated rollers, each of said opposed, heated rollers engaging a respective one of said first and second dielectric layers as said first and second dielectric layers and said first conductive layer pass between said pair of opposed, heated rollers.
4. The method of claim 1 wherein said forming of said holes is accomplished by a process selected from the group of processes consisting of mechanical drilling, punching and laser ablation.
5. The method of claim 4 wherein said process for forming said holes is laser ablation and involves utilization of a UV-YAG laser.
6. The method of claim 1 wherein said providing of electrically conductive material within said holes is accomplished using a plating process.
7. The method of claim 6 wherein said holes are seeded prior to implementation of said plating process.
8. The method of claim 1 wherein said segmenting of said continuous bonded structure to define a plurality of circuitized substrates is accomplished using a shearing process.
9. The method of claim 1 further including the step of bonding third and fourth dielectric layers each having a conductive layer thereon to said first and second dielectric layers following said bonding of said first and second dielectric layers to said first and second opposing surfaces of said first conductive layer respectively, to form a continuous, bonded structure, and prior to said forming of said holes within said continuous, bonded structure in a plurality of patterns such that said holes extend entirely through the thickness of said structure, said method further including also forming said holes within said third and fourth dielectric layers and said conductive layers thereon.
10. The method of claim 9 wherein said bonding of said third and fourth dielectric layers each having a conductive layer thereon to said first and second dielectric layers is accomplished using a pair of opposed, heated rollers, each of said opposed, heated rollers engaging a respective one of said conductive layers on said third and fourth dielectric layers, respectively, as said third and fourth dielectric layers having said conductive layers thereon pass between said pair of opposed, heated rollers.
11. The method of claim 1 wherein said providing of said electrically conductive material within said holes comprises positioning a quantity of conductive paste within said holes.
12. The method of claim 11 further including the step of bonding third and fourth dielectric layers each having a conductive layer thereon to said first and second dielectric layers following said bonding of said first and second dielectric layers to said first and second opposing surfaces of said first conductive layer respectively, to form a continuous, bonded structure, and prior to said forming of said holes within said continuous, bonded structure in a plurality of patterns such that said holes extend entirely through the thickness of said structure, said method further including also forming said holes within said third and fourth dielectric layers and said conductive layers thereon.