IP Library Granted Patent US 7,269,057
Granted Patent B2
US 7,269,057 · App. 11/116,024 · Granted Sep 11, 2007

Method for connecting circuit elements within an integrated circuit for reducing single-event upsets

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Quick Facts
Patent No.
US 7,269,057
App. No.
11/116,024
Granted
Sep 11, 2007
Kind
B2
Abstract

A method for connecting circuit elements within an integrated circuit for reducing single-event upsets is disclosed. The integrated circuit includes a first and second circuit elements that are substantially identical to each other. In order to reduce the single-event upsets to the first and second circuit elements, each of the first and second circuit elements is divided into a first sub-element and a second sub-element. The first sub-element of the first circuit element is connected to the second sub-element of the second circuit element. The second sub-element of the first circuit element is connected to the first sub-element of the second circuit element. As a result, the nodal spacings between the sub-elements within the first and second circuit elements are effectively increased without demanding additional real estate.

Claims (21)

1. A method for connecting circuit elements within an integrated circuit for reducing single-events upsets, said method comprising:

dividing a first circuit element into a first sub-element and a second sub-element such that said first sub-element of said first circuit element is not connected to said second sub-element of said first circuit element;

dividing a second circuit element into a first sub-element and a second sub-element such that said first sub-element of said second circuit element is not connected to said second sub-element of said second circuit element, wherein said first and second circuit elements are substantially identical to each other;

connecting said first sub-element of said first circuit element to said second sub-element of said second circuit element; and

connecting said second sub-element of said first circuit element to said first sub-element of said second circuit element such that nodal spacings between sub-elements are effectively increased.

2. The method of claim 1 , wherein said first circuit element is located at an adjacent end of said second circuit element.

3. The method of claim 1 , wherein said first circuit element is located at an adjacent side of said second circuit element.

4. An integrated circuit comprising:

a first circuit element having a first sub-element and a second sub-element, wherein said first sub-element of said first circuit element is not connected to said second sub-element of said first circuit element;

a second circuit element having a first sub-element and a second sub-element, wherein said first sub-element of said second circuit element is not connected to said second sub-element of said second circuit element, wherein said first and second circuit elements are substantially identical to each other;

interconnects for connecting said first sub-element of said first circuit element to said second sub-element of said second circuit element; and

interconnects for connecting said second sub-element of said first circuit element to said first sub-element of said second circuit element such that nodal spacings between sub-elements are effectively increased.

5. The integrated circuit of claim 4 , wherein said first circuit element is located at an adjacent end of said second circuit element.

6. The integrated circuit of claim 4 , wherein said first circuit element is located at an adjacent side of said second circuit element.

7. A static random access memory comprising:

a first circuit element having two p-channel transistors and two n-channel transistors, wherein said two p-channel transistors of said first circuit element are not connected to said two n-channel transistors of said first circuit element;

a second circuit element having two p-channel transistors and two n-channel transistors, wherein said two p-channel transistors of said second circuit element are not connected to said two n-channel transistors of said second circuit element, wherein said first and second circuit elements are substantially identical to each other;

interconnects for connecting said two p-channel transistors of said first circuit element to said two n-channel transistors of said second circuit element; and

interconnects for connecting said two p-channel transistors of said second circuit element to said two n-channel transistors of said first circuit element.

8. The static random access memory of claim 7 , wherein said first circuit element is located at an adjacent end of said second circuit element.

9. The static random access memory of claim 7 , wherein said first circuit element is located at an adjacent side of said second circuit element.

Assignments (2)
MERGER Recorded Jan 22, 2016
From: SCHILMASS CO. L.L.C.
To: GULA CONSULTING LIMITED LIABILITY COMPANY
Reel/Frame 037559/0856 →
CORRECTIVE ASSIGNMENT TO CORRECT THE STATE OF INCORPORATION OF ASSIGNEE. SHOULD STATE A DELAWARE CORPORATION NOT A NEW HAMPSHIRE CORPORATION AS PREVIOUSLY RECORDED ON REEL 016370 FRAME 0349. ASSIGNOR(S) HEREBY CONFIRMS THE BAE SYSTEMS, INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION, INC., A NEW HAMPSHIRE CORPORATION. Recorded Jun 26, 2012
From: HADDAD, NADIM F.; WOOD, NEIL E.; BUMGARNER, ADAM; NEIDERER, WAYNE; RAMASWAMY, SHANKARNARAYANA; DOYLE, SCOTT; HOANG, TRI-MINH
To: BAE SYSTEMS, INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION, INC.
Reel/Frame 028448/0378 →