IP Library Assignment 037559/0856
Patent Assignment
Reel/Frame 037559/0856

Merger

Recorded: 2016-01-22 Pages: 23
Assignor
SCHILMASS CO. L.L.C.
Executed: 2015-08-26
Assignee
GULA CONSULTING LIMITED LIABILITY COMPANY
160 GREENTREE DRIVE, SUITE 101, DOVER, DELAWARE, 19904
Covered Properties (42)
Memory Device Having Reduced Power Requirements and Associated Methods
Patent: 6,181,641 →
Application: 09/320,227 →
Radiation Hardened Six Transistor Random Access Memory and Memory Device
Patent: 6,111,780 →
Application: 09/325,645 →
Self-restoring single event upset (seu) hardened multiport memory cell
Patent: 6,215,694 →
Application: 09/553,595 →
Method and Apparatus for a Voltage Responsive Reset for Eeprom
Patent: 6,418,056 →
Application: 09/563,197 →
Low -Power Cmos Device and Logic Gates/Circuits Therewith
Patent: 6,429,492 →
Application: 09/598,681 →
Intergrated Circuit Capable of Operating at Two Different Power Supply Voltages
Patent: 6,468,860 →
Application: 09/713,813 →
Multi-Color, Multi-Focal Plane Optical Detector
Patent: 6,875,975 →
Application: 09/746,956 →
Publication: US 2002/0008191
Eyesafe Q-Switched Laser
Patent: 6,810,052 →
Application: 09/841,727 →
Publication: US 2001/0036205
System and Method for Comparing Signals
Patent: 6,622,118 →
Application: 09/879,736 →
Cmos Sram Cell with Prescribed Power-on Data State
Patent: 6,576,962 →
Application: 09/911,871 →
Publication: US 2002/0020885
High-Performance High-Density Cmos Sram Cell
Patent: 6,570,227 →
Application: 09/911,872 →
Publication: US 2002/0020886
Acoustical Array with Multilayer Substrate Integrated Circuits
Patent: 6,589,180 →
Application: 10/094,851 →
Publication: US 2003/0013969
Method and Apparatus for a Voltage Responsive Reset for Eeprom
Patent: 6,556,478 →
Application: 10/117,063 →
Publication: US 2002/0110025
Piezocomposite Ultrasound Array and Integrated Circuit Assembly with Improved Thermal Expansion and Acoustical Crosstalk Characteristics
Patent: 6,776,762 →
Application: 10/172,536 →
Publication: US 2003/0018267
Apparatus and Method for Manufacturing a Semiconductor Circuit
Patent: 6,762,128 →
Application: 10/177,915 →
Publication: US 2002/0182884
High-Density Interconnection of Temperature Sensitive Electronic Devices
Patent: 6,716,669 →
Application: 10/284,999 →
Publication: US 2004/0023433
Orthogonally Reconfigurable Integrated Matrix Acoustically Array
Patent: 6,752,763 →
Application: 10/308,246 →
Publication: US 2003/0120153
Thermal Mismatch Compensation Technique for Integrated Circuit Assemblies
Patent: 6,675,600 →
Application: 10/310,230 →
Reconfigurable Digital Processing System for Space
Patent: 6,996,443 →
Application: 10/334,317 →
Publication: US 2004/0078103
Method and Apparatus for Increasing the Intensity of an Eye Safe Laser
Patent: 6,898,218 →
Application: 10/424,300 →
Publication: US 2004/0012841
Reconfigurable Digital Processing System for Space
Patent: 7,142,953 →
Application: 10/672,844 →
Publication: US 2004/0148069
Lithographic Semiconductor Manufacturing Using a Multi-Layered Process
Patent: 7,229,745 →
Application: 10/710,023 →
Publication: US 2005/0277064
Qwip with Enhanced Optical Coupling
Patent: 7,238,960 →
Application: 10/781,523 →
Publication: US 2004/0159775
Qwip with Electron Launcher for Reducing Dielectric Relaxation Effect in Low Background Conditions
Patent: 7,205,563 →
Application: 10/803,295 →
Publication: US 2005/0205857
Qwip with Tunable Spectral Response
Patent: 7,291,858 →
Application: 10/829,574 →
Publication: US 2004/0195509
Zero Reflectance Design for Tilted Devices
Patent: 6,974,219 →
Application: 10/888,209 →
Use of Radiation-Hardened Chalcogenide Technology for Spaceborne Reconfigurable Digital Processing Systems
Patent: 7,337,160 →
Application: 10/918,814 →
Publication: US 2005/0027409
Dynamic Range Extension for Focal Plane Arrays
Patent: 7,489,351 →
Application: 11/038,167 →
Publication: US 2006/0164530
Method for Connecting Circuit Elements Within an Integrated Circuit for Reducing Single-Event Upsets
Patent: 7,269,057 →
Application: 11/116,024 →
Publication: US 2006/0245124
Radiation-Tolerant Integrated Circuit Device and Method for Fabricating
Patent: 8,389,370 →
Application: 11/194,295 →
Publication: US 2005/0275069
Broadband Transmission Line Transformer
Patent: 7,583,160 →
Application: 11/224,972 →
Publication: US 2006/0061431
Seismic Modem
Patent: 7,307,915 →
Application: 11/371,560 →
Publication: US 2007/0223313
Photo-Patterned Carbon Electronics
Patent: 7,572,482 →
Application: 11/404,435 →
Publication: US 2007/0243319
Non-Directional Laser-Based Self-Protection
Patent: 7,925,159 →
Application: 11/436,423 →
Publication: US 2007/0236382
Solid-State Ultra-Wideband Microwave Power Amplifier Employing Modular Non-Uniform Distributed Amplifier Elements
Patent: 7,924,097 →
Application: 11/629,025 →
Publication: US 2009/0309659
Qwip with Electron Launcher for Reducing Dielectric Relaxation Effect in Low Background Conditions
Patent: 7,372,068 →
Application: 11/675,653 →
Publication: US 2007/0138461
Method for the Production of Photo-Patterned Carbon Electronics
Patent: 8,076,218 →
Application: 12/497,752 →
Publication: US 2009/0267189
Broadband Transmission Line Transformer
Patent: 7,839,232 →
Application: 12/507,836 →
Publication: US 2009/0284323
High Power Amplifier
Patent: 8,669,812 →
Application: 13/016,599 →
Publication: US 2012/0268213
Broadband High Power Amplifier
Patent: 8,076,975 →
Application: 13/081,279 →
Broadband High Power Amplifier
Patent: 8,576,009 →
Application: 13/316,900 →
Publication: US 2012/0081182
Photo-Patterned Carbon Electronics
Patent: 9,105,850 →
Application: 13/316,920 →
Publication: US 2012/0098101
Related Assignments (10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 13, 2018
From: LOCKHEED MARTIN CORPORATION
To: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
Reel/Frame 046625/0568 →
Assignment of Assignor's Interest Jan 17, 2019
From: INTELLECTUAL VENTURES ASSETS 106 LLC
To: AIDO LLC
Reel/Frame 048046/0185 →
Assignment of Assignor's Interest Jan 3, 2020
From: GULA CONSULTING LIMITED LIABILITY COMPANY
To: INTELLECTUAL VENTURES ASSETS 154 LLC
Reel/Frame 051411/0491 →
Assignment of Assignor's Interest Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest Jan 27, 2020
From: INTELLECTUAL VENTURES ASSETS 154 LLC
To: LIBERTY PATENTS LLC
Reel/Frame 051709/0805 →
Assignment of Assignor's Interest Feb 1, 2020
From: GULA CONSULTING LIMITED LIABILITY COMPANY
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 052159/0463 →
Assignment of Assignor's Interest May 14, 2021
From: HANGER SOLUTIONS, LLC
To: FOOTHILLS IP LLC
Reel/Frame 056246/0533 →
Assignment of Assignor's Interest Feb 12, 2023
From: GULA CONSULTING LIMITED LIABILITY COMPANY
To: INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 062756/0052 →
Security Interest Mar 24, 2023
From: MIND FUSION, LLC
To: INTELLECTUAL VENTURES ASSETS 191 LLC; INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 063295/0001 →
Assignment of Assignor's Interest Jul 13, 2023
From: INTELLECTUAL VENTURES ASSETS 186 LLC
To: MIND FUSION, LLC
Reel/Frame 064271/0001 →