Pattern detection for integrated circuit substrates
View Patent ↗A method for selecting test site locations on a substrate, by a) specifying a subset of all test site locations on the substrate, and b) selecting a desired number of candidate test site locations from within the subset of test site locations on the substrate. c) While selecting one of the candidate test site locations and holding all others of the candidate test site locations as fixed, determining a new location for the selected one of the candidate test site locations, which new location increases a test sensitivity, as estimated by a trace of a variance-covariance matrix. d) Repeating step (c) for each candidate test site location in the subset of test site locations, to produce a finalized set of candidate test site locations, until a desired end point is attained.
1. A method for selecting test site locations on a substrate, the method comprising the steps of:
a) specify a subset of all test site locations on the substrate,
b) select a desired number of candidate test site locations from within the subset of test site locations on the substrate,
c) while selecting one of the candidate test site locations and holding all others of the candidate test site locations as fixed, determine a new location for the selected one of the candidate test site locations, which new location increases a test sensitivity to at least one predetermined pattern, as estimated by a trace of a variance-covariance matrix, and
d) repeat step c for each candidate test site location in the subset of test site locations to produce a finalized set of candidate test site locations, until a desired end point is attained.
2. The method of claim 1 , wherein the desired end point is that the test sensitivity cannot be further increased by selecting a new location within the finalized subset of test site locations on the substrate.
3. The method of claim 1 , wherein the desired end point is that all locations within the finalized subset of test site locations on the substrate have been adjusted for a desired number of iterations.
4. The method of claim 1 , wherein the desired end point is that the test sensitivity has attained a desired level.
5. The method of claim 1 , further comprising the steps of:
sense characteristics of the substrate at the finalized subset of test site locations, and
analyze the sensed characteristics to determine whether the sensed characteristics indicate the predetermined pattern on the substrate.
6. The method of claim 5 , wherein the characteristics of the substrate are sensed by one of optical inspection and electrical test of the substrate.
7. The method of claim 5 , wherein the characteristics of the substrate are sensed by a measurement system that provides a quantitative value associated with a spatial coordinate on the substrate.
8. The method of claim 1 , further comprising the steps of:
sense characteristics of the substrate at the finalized subset of test site locations, and
analyze the sensed characteristics to determine whether the sensed characteristics indicate that the predetermined pattern on the substrate has changed by at least a given amount.
9. The method of claim 8 , wherein the characteristics of the substrate are sensed by one of optical inspection and electrical test of the substrate.
10. The method of claim 8 , wherein the characteristics of the substrate are sensed by a measurement system that provides a quantitative value associated with a spatial coordinate of the substrate.
11. A method for analyzing a substrate, the method comprising the steps of:
a) specify a subset of all test site locations on the substrate,
b) select a desired number of candidate test site locations from within the subset of test site locations on the substrate,
c) while selecting one of the candidate test site locations and holding all others of the candidate test site locations as fixed, determine a new location for the selected one of the candidate test site locations, which new location increases a test sensitivity to at least one predetermined pattern, as estimated by a trace of a variance-covariance matrix,
d) repeat step c for each candidate test site location in the subset of test site locations to produce a finalized set of candidate test site locations, until a desired end point is attained,
e) sense characteristics of the substrate at the finalized subset of test site locations, and
f) analyze the sensed characteristics to determine whether the sensed characteristics indicate the predetermined pattern on the substrate.
12. The method of claim 11 , wherein the desired end point is that the test sensitivity cannot be further increased by selecting a new location within the finalized subset of test site locations on the substrate.
13. The method of claim 11 , wherein the desired end point is that all locations within the finalized subset of test site locations on the substrate have been adjusted for a desired number of iterations.
14. The method of claim 11 , wherein the desired end point is that the test sensitivity has attained a desired level.
15. The method of claim 11 , wherein the characteristics of the substrate are sensed by at least one of optical inspection of the substrate and electrical test of the substrate.
16. A method for analyzing a substrate, the method comprising the steps of:
a) specify a subset of all test site locations on the substrate,
b) select a desired number of candidate test site locations from within the subset of test site locations on the substrate,
c) while selecting one of the candidate test site locations and holding all others of the candidate test site locations as fixed, determine a new location for the selected one of the candidate test site locations, which new location increases a test sensitivity to at least one predetermined pattern, as estimated by a trace of a variance-covariance matrix,
d) repeat step c for each candidate test site location in the subset of test site locations to produce a finalized set of candidate test site locations, until a desired end point is attained,
e) sense characteristics of the substrate at the finalized subset of test site locations, and
f) analyze the sensed characteristics to determine whether the sensed characteristics indicate that the predetermined pattern on the substrate has changed by at least a given amount.
17. The method of claim 16 , wherein the desired end point is that the test sensitivity cannot be further increased by selecting a new location within the finalized subset of test site locations on the substrate.
18. The method of claim 16 , wherein the desired end point is that all locations within the finalized subset of test site locations on the substrate have been adjusted for a desired number of iterations.
19. The method of claim 16 , wherein the desired end point is that the test sensitivity has attained a desired level.
20. The method of claim 16 , wherein the characteristics of the substrate are sensed by at least one of optical inspection of the substrate and electrical test of the substrate.