Electrode pad arrangement with open side for waste removal
View Patent ↗A pad structure 100 includes an electrode pad (a first electrically conducting film 104 and a second electrically conducting film 110 ) and an insulating film provided over a peripheral region of the electrode pad so as to surround the electrode pad, and the insulating film has a structure including a protective film (a cover oxide film 106 ) and a transparent resin film (a transparent resin 108 ) provided on the cover oxide film 106.
1. A semiconductor device, comprising:
a peripheral portion and an interior portion inside said peripheral portion;
an interlayer film (105);
an electrode pad having an exposed metal wire-contact layer (110) on said interlayer film;
a first insulating film (106) covering said interior portion of the device and an edge of said metal wire-contact layer, said first insulating film having a plurality of first openings that each expose a respective first part of said metal wire-contact layer; and
a second insulating film (108 c ) covering said first insulating film in said interior portion and covering a part of the edge of said metal wire-contact layer covered by said first insulating film, said second insulating film having a plurality of second openings that each expose a respective said first part of said metal wire-contact layer and a part of said first insulating film surrounding the respective first part of said metal wire-contact layer, said second insulating film extending only partially around said first openings so that said second openings open to said peripheral portion of the device and are coupled to each other at said peripheral portion.
2. The semiconductor device of claim 1 , wherein said first and second openings are rectangular.
3. The semiconductor device of claim 1 , wherein said second insulating film is a resin film.
4. The semiconductor device of claim 1 , wherein said first insulating film is a cover oxide and said second insulating film is a transparent resin film.
5. The semiconductor device of claim 1 , wherein the first part of said metal wire-contact layer exposed by said first openings is a concavity, and said metal wire-contact layer further includes a second part that contacts the first part beneath the concavity, said interlayer film being between said first and second parts outside the concavity.
6. The semiconductor device of claim 1 , further comprising a plurality of electrode pads that each include an exposed part of said metal wire-contact layer adjacent to said peripheral portion of the device.
7. The semiconductor device of claim 1 , wherein the device is a solid-state image sensing device.