Image sensor package and fabrication method
View Patent ↗An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent one another. A package in accordance with the present invention reduces the amount of space in the package by allowing at least one surface of the image sensor controller and at least one surface of the image sensor to be directly attached or connected to one another. Electrical conductive material in the nature of anisotropic conductive materials is also preferably applied to the substrate in the form of an adhesive layer to allow for the image sensor controller and the image sensor to be in electrical communication with one another.
1. An image sensor package comprising:
(a) a substrate having a first surface and a second surface, the substrate having an opening extending through the substrate from the first surface to the second surface;
(b) an image sensor attached to the second surface of the substrate so that the image sensor is aligned with the opening of the substrate, the image sensor having opposing first and second surfaces;
(c) a transparent body adhered to the first surface of the substrate and overlying the opening and the first surface of the image sensor; and
(d) an image sensor controller attached to the second surface of the substrate and having opposing first and second surfaces, the second surface of the image sensor controller and the second surface of the image sensor being directly attached to one another so that the second surfaces of the image sensor and the image sensor controller are directly adjacent one another, the first and second surfaces of the substrate supporting electrically conductive elements so that the image sensor and the image sensor controller are in electrical communication with one another wherein an adhesive is disposed between the second surfaces of the image sensor and image sensor controller and attaches the second surfaces of the image sensor and the image sensor controller to one another.
2. The image sensor package according to claim 1 , wherein an anisotropic adhesive is used to adhere the image sensor to the substrate.
3. The image sensor package according to claim 1 , wherein an anisotropic adhesive is used to adhere the image sensor controller to the substrate.
4. The image sensor package according to claim 1 , wherein a wire connects the image sensor to the image sensor controller.
5. The image sensor package according to claim 1 , wherein the substrate is flexible.
6. The image sensor package according to claim 1 , wherein the substrate is rigid.
7. The image sensor package according to claim 1 , further including a circuit board for an electronic device, the circuit board being connected to the electrically conductive elements of the substrate.
8. The image sensor package according to claim 1 , wherein the substrate is folded over itself.
9. An electronic device for creating digital images, the device comprising:
a housing;
an image sensor package within the housing, the image sensor package including;
a substrate having a first surface and a second surface, the substrate having an opening extending through the substrate from the first surface to the second surface;
an image sensor attached to the second surface of the substrate so that the image sensor is aligned with the opening of the substrate, the image sensor having opposing first and second surfaces;
a transparent body adhered to the first surface of the substrate and overlying the opening and the first surface of the image sensor; and
an image sensor controller attached to the second surface of the substrate and having opposing first and second surfaces, the second surface of the image sensor controller and the second surface of the image sensor being directly attached to one another so that the second surfaces of the image sensor and the image sensor controller are directly adjacent one another,
the substrate supporting electrically conductive elements so that the image sensor and the image sensor controller are electrically connected to one another; and
an electronic module responsive to the image sensor controller for at least creating digital images within the housing,
the image sensor and the image sensor controller being electrically connected to the electronic module.
10. The image sensor package of claim 9 , wherein the substrate is U-shaped.
11. An image sensor package comprising:
(a) a sensor substrate having oppositely-directed first and second surfaces, an opening extending therebetween, and electrically conductive elements exposed at the second surface;
(b) an image sensor mounted to the sensor substrate and facing the second surface of the sensor substrate, the image sensor being aligned with the opening in the sensor substrate and electrically coupled to the electrically conductive elements of the sensor substrate;
(c) a transparent body coupled to the first surface of the sensor substrate in alignment with the opening;
(d) a controller substrate having a first surface facing toward the sensor substrate and a second surface facing away from the sensor substrate, the image sensor being disposed between the sensor substrate and controller substrate, the controller substrate having first electrically conductive elements exposed at the first surface of the controller substrate and connected to the electrically conductive elements of the sensor substrate, the controller substrate having second electrically conductive elements exposed at the second surface of the controller substrate, the second electrically conductive elements being adapted for mounting to a circuit board; and
(e) an image controller mounted to the controller substrate and electrically connected to the sensor through the first conductive elements of the controller substrate and the conductive elements of the sensor substrate.
12. The image sensor package of claim 11 , wherein the image sensor is electrically connected to the electrically conductive elements of the sensor substrate by anisotropic conductive material.
13. The image sensor package of claim 11 , wherein the transparent body is attached to the sensor substrate by compliant material.
14. The image sensor package of claim 11 , further including a circuit board arranged opposing the image controller substrate, the circuit board being electrically coupled to at least the second electrically conductive elements.
15. The image sensor package of claim 11 , wherein the controller substrate is folded over itself forming spaced apart opposing first and second image controller substrate portions with the image controller arranged therebetween.
16. A device comprising a housing, a circuit board disposed within the housing and a package as claimed in claim 11 disposed within the housing and mounted to the circuit board, the circuit board having conductive features, the second electrically conductive elements of the controller substrate being connected to the conductive features of the circuit board.
17. The device of claim 16 , wherein the device comprises a cellular phone.
18. The device of claim 16 , wherein the device comprises a personal digital assistant.
19. The device of claim 16 , wherein the image sensor is electrically coupled to the electrical conductive elements of the sensor substrate by anisotropic conductive material.
20. The device of claim 16 , wherein the transparent body is attached to the sensor substrate by compliant material.
21. The device of claim 16 , wherein the controller substrate is folded over itself forming spaced apart opposing first and second controller substrate portions with the image controller arranged therebetween.