Low-profile capillary for wire bonding
View Patent ↗A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.
1. A wire bonding tool comprising:
a first cylindrical portion having a first outside cylindrical diameter, the first cylindrical portion being configured to be engaged with a transducer of a wire bonding machine such that the length of the first cylindrical portion does not extend below the transducer during engagement with the transducer;
a second cylindrical portion adjacent the first cylindrical portion, the second cylindrical portion having a second outside cylindrical diameter, the second outside cylindrical diameter being less than the first outside cylindrical diameter; and
a tapered portion adjacent the second cylindrical portion, the tapered portion having a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside cylindrical diameter;
wherein a tip of an EFO wand is configured to be positioned directly adjacent (1) the second cylindrical portion and (2) a lower end of the transducer during a wire bonding operation.
2. The wire bonding tool of claim 1 wherein the second outside cylindrical diameter is substantially identical to the third outside diameter.
3. The wire bonding tool of claim 1 wherein the wire bonding tool defines a passage extending through each of the first cylindrical portion, the second cylindrical portion, and the tapered portion.
4. The wire bonding tool of claim 3 wherein the passage extends along a centerline of the wire bonding tool.
5. The wire bonding tool of claim 3 wherein the passage is tapered such that a diameter of the passage decreases from the first cylindrical portion to the tapered portion.
6. The wire bonding tool of claim 1 wherein the tapered portion has a conical shape.
7. The wire bonding tool of claim 1 wherein the second outside cylindrical diameter is substantially constant along a length of the second cylindrical portion.
8. The wire bonding tool of claim 1 wherein the first outside cylindrical diameter is approximately 0.0625 inches, and the second outside cylindrical diameter is approximately 0.0375 inches.