Patent Assignment
Reel/Frame 016722/0294
Merger
Recorded: 2005-11-03
Pages: 6
Assignor
KULICKE AND SOFFA INVESTMENTS, INC.
Executed: 2005-10-21
Assignee
KULICKE AND SOFFA INDUSTRIES, INC.
2101 BLAIR MILL ROAD, WILLOW GROVE, PENNSYLVANIA, 19090
Covered Properties
(5)
High Density Chip Level Package for the Packaging of Integrated Circuits and Method to Manufacture Same
High Speed Linear and Rotary Split-Axis Wire Bonder
High Density Chip Level Package for the Packaging of Integrated Circuits and Method to Manufacture Same
Method of Bumping Die Pads for Wafer Testing
Low-Profile Capillary for Wire Bonding
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 1, 2004
From: BEATSON, DAVID T.; SURESH, KRISHMAN
To: KULICKE & SOFFA INVESTMENTS, INC.
Reel/Frame 015031/0786 →
Assignment of Assignor's Interest
Jun 22, 2005
From: EDER, JAMES E.; BRUNNER, JON
To: KULICKE AND SOFFA INVESTMENTS, INC.
Reel/Frame 016716/0605 →
Assignment of Assignor's Interest
Jul 28, 2005
From: BEATSON, DAVID T.
To: KULICKE AND SOFFA INVESTMENTS, INC.
Reel/Frame 016826/0785 →
Merger
Dec 2, 2005
From: KULICKE & SOFFA INVESTMENTS, INC.
To: KULICKE AND SOFFA INDUSTRIES, INC.
Reel/Frame 016842/0990 →
Conversion to Llc
Mar 14, 2011
From: FCI AMERICAS TECHNOLOGY, INC.
To: FCI AMERICAS TECHNOLOGY LLC
Reel/Frame 025957/0432 →