Patent Assignment
Reel/Frame 016826/0785
Assignment of Assignor's Interest
Recorded: 2005-07-28
Pages: 2
Assignor
BEATSON, DAVID T.
Executed: 2005-07-06
Assignee
KULICKE AND SOFFA INVESTMENTS, INC.
2751 CENTERVILLE ROAD, LITTLE FALLS CENTER II, WILMINGTON, DELAWARE, 19808
Covered Property
(1)
Method of Bumping Die Pads for Wafer Testing
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.