Semiconductor device and method for manufacturing same
View Patent ↗A semiconductor device comprises a drift region of a first conduction type, a base region of a second conduction type, a source region of the first conduction type, a contact hole, a column region of the second conduction type, a plug and wiring. The drift region formed on a semiconductor substrate of the first conduction type. The base region of a second is formed in a prescribed region of the surface of the drift region. The source region is formed in a prescribed region of the surface of the base region. The contact hole extends from the source region surface side to the base region. The column region is formed in the drift region below the contact hole. The plug comprises a first conductive material and fills the contact hole. The wiring comprises a second conductive material and is electrically connected to the plug.
1. A semiconductor device comprising:
a drift region of a first conduction type, formed on a semiconductor substrate;
a base region of a second conduction type formed in a prescribed region of the drift region;
a source region of the first conduction type formed in a prescribed region of the base region;
a contact hole formed in the base region;
a column region of the second conduction type formed in the drift region below the contact hole;
a plug of a conductive material filling the contact hole; and,
a wiring comprising a conductive material and electrically connected to the plug.
2. The semiconductor device according to further comprising a gate electrode formed over the base region, with a gate insulating film intervening.
3. The semiconductor device according to further comprising a gate electrode formed in each of the base region and the drift region with a gate insulating film intervening.
4. The semiconductor device according to claim 1 , wherein the plug connects to the base region at a bottom of the plug.
5. The semiconductor device according to claim 3 , wherein the gate electrode is formed in the source region with the gate insulating film intervening.
6. The semiconductor device according to claim 1 , wherein the conductive material of the plug comprises tungsten.
7. The semiconductor device according to claim 6 , wherein the conductive material of the wiring comprises aluminum.