IP Library Granted Patent US 7,449,776
Granted Patent B2
US 7,449,776 · App. 11/126,430 · Granted Nov 11, 2008

Cooling devices that use nanowires

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Quick Facts
Patent No.
US 7,449,776
App. No.
11/126,430
Granted
Nov 11, 2008
Kind
B2
Abstract

Different types of cooling devices using nanowires are described. For example, a cooling device may include a plurality of diamond nanowires coupled to a surface. The diamond nanowires conduct heat energy from the surface and dissipate the heat energy into a neighboring fluid.

Claims (9)

1. A cooling device comprising:

a channel comprising a first surface and a second surface separated by a gap;

a first plurality of diamond nanowires grown on said first surface wherein one of said first plurality of diamond nanowires conducts heat energy from said first surface and dissipates said heat energy into a liquid that is in direct contact with said first plurality of nanowires and wherein one of said first plurality of diamond nanowires contacts said second surface, thereby bridging said gap; and

a second plurality of diamond nanowires grown on said second surface wherein one of said second plurality of diamond nanowires conducts heat energy from said second surface and dissipates said heat energy into said liquid and wherein one of said second plurality of diamond nanowires contacts said first surface, thereby bridging said gap wherein a diamond nanowire in contact with both said first and second surfaces comprises a first portion doped with p-type dopant and a second portion doped with n-type dopant to form a p-n junction in said diamond nanowire, wherein application of an electrical current to said diamond nanowire induces thermoelectric cooling of said diamond nanowire.

2. The cooling device of claim 1 wherein heat energy is conducted by said diamond nanowire from said first surface to said second surface.

3. The cooling device of claim 1 wherein said gap is in the range of approximately 10-50 microns.

4. The cooling device of claim 1 wherein said first surface is mounted as a fin on an object to be cooled.

5. The cooling device of claim 1 wherein said diamond nanowires are sprayed with said liquid.

6. The cooling device of claim 1 wherein said diamond nanowires have diameters of less than approximately 100 nanometers.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2011
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; HEWLETT-PACKARD COMPANY
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026198/0139 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 10, 2005
From: WANG, SHIH-YUAN; ISLAM, M. SAIF; KUEKES, PHILIP J.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 016564/0975 →