IP Library › Granted Patent US 7,131,882
Granted Patent B2
US 7,131,882 · App. 11/128,170 · Granted Nov 7, 2006

Manufacturing method of organic flat light-emitting devices

Assignee: RitDisplay Corporation
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Quick Facts
Patent No.
US 7,131,882
App. No.
11/128,170
Granted
Nov 7, 2006
Kind
B2
Abstract

A manufacturing method of organic flat light-emitting devices includes the following steps. First, a transparent substrate is provided, which has several microstructures on its first surface and the microstructures have a maximum height of 100 μm from the first surface. Second, a transparent anode is formed on the second surface of the transparent substrate that is opposite to the first surface. Thirdly, at least one organic electro-luminescent layer is formed on the transparent anode. Finally, a metal cathode is formed on the organic electro-luminescent layer. Another manufacturing method of organic flat light-emitting devices includes the steps of: forming a transparent thin film on a first surface of a transparent substrate, the transparent thin film having a plurality of microstructures with a maximum height of 100 μm; forming a transparent anode on a second surface of the transparent substrate opposite to the first surface; forming at least one organic electro-luminescent layer; and forming a metal cathode on the organic electro-luminescent layer.

Claims (15)

1. A manufacturing method of organic flat light-emitting devices, comprising the steps of:

providing a transparent thin film on a first surface of a transparent substrate, the transparent thin film having a plurality of microstructures and the microstructures having a maximum height of 100 μm;

forming a transparent anode on a second surface of the transparent substrate opposite to the first surface;

forming at least an organic electro-luminescent layer; and

forming a metal cathode on the organic electro-luminescent layer.

2. The manufacturing method of claim 1 , wherein the transparent substrate is a plastic substrate.

3. The manufacturing method of claim 1 , wherein the transparent substrate is a flexible substrate.

4. The manufacturing method of claim 1 , wherein the transparent substrate is a glass substrate.

5. The manufacturing method of claim 1 , wherein the thickness of the transparent substrate is between 0.2 mm and 5 mm.

6. The manufacturing method of claim 1 , wherein the transparent thin film is formed on the first surface by an adhesive method.

7. The manufacturing method of claim 1 , wherein the microstructures have a curved surface.

8. The manufacturing method of claim 7 , wherein the curved surface has a spherical shape with a diameter between 10 μm and 500 μm.

9. The manufacturing method of claim 7 , wherein the curved surface has a cylindrical shape with a diameter between 10 μm and 500 μm and a length between 10 μm and 500 μm.

10. The manufacturing method of claim 7 , wherein the curved surface is a protruding surface having a square border with a side length between 10 μm and 500 μm.

11. The manufacturing method of claim 1 , wherein the transparent thin film is formed by an adhering method.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2014
From: EPSILON INSTRUMENTS INC.
To: III HOLDINGS 1, LLC
Reel/Frame 034189/0900 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2014
From: RITDISPLAY CORPORATION
To: EPSILON INSTRUMENTS INC.
Reel/Frame 032749/0083 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2014
From: WEI, MAO-KUO; WANG, JIH-YI
To: RITDISPLAY CORPORATION
Reel/Frame 032598/0756 →
Priority Claims (1)
TW 90133401 A · Dec 31, 2001 · national
Continuity (2)
Division 1031005600 · Dec 5, 2002
Related Publication 20050208864A1 · Sep 22, 2005