Method of manufacturing flat lamp
Provided is a method of manufacturing a flat lamp. An embodiment of the method includes attaching at least a spacer on a lower substrate, coating a first sealing paste on an upper rim portion of the lower substrate and attaching a frame for sealing a discharge space on the first sealing paste, coating a phosphor on an upper surface of the lower substrate, surfaces of the spacers, and an inner wall of the frame, and firing the first sealing paste and the phosphor at a predetermined temperature.
1 . A method of manufacturing a flat lamp comprising:
attaching at least a spacer on a lower substrate;
coating a first sealing paste on an upper rim portion of the lower substrate and attaching a frame for sealing a discharge space on the first sealing paste;
coating a phosphor on an upper surface of the lower substrate, surfaces of the spacers, and an inner wall of the frame; and
firing the first sealing paste and the phosphor at a predetermined temperature.
2 . The method of claim 1 , wherein the first sealing paste and the phosphor are fired at a temperature of about 450 to about 490° C.
3 . The method of claim 2 , wherein the first sealing paste and the phosphor are fired at a temperature of about 480° C.
4 . The method of claim 2 , wherein the first sealing paste is a frit paste.
5 . The method of claim 4 , wherein the frit paste is a plastic based paste.
6 . The method of claim 1 , wherein the attaching the spacers includes forming a dielectric layer on an upper surface of the lower substrate and attaching the spacers on the dielectric layer.
7 . The method of claim 1 , further comprising forming at least a lower electrode on the lower substrate.
8 . The method of claim 7 , wherein the lower electrodes are formed on a lower surface of the lower substrate before attaching the spacers on the lower substrate.
9 . The method of claim 8 , wherein the lower electrodes are formed by forming an electrode material in a predetermined shape on a lower surface of the lower substrate and firing the electrode material at a temperature of about 530 to about 590° C.
10 . The method of claim 1 , further comprising:
forming a phosphor layer on a lower surface of the upper substrate; and
coupling the upper substrate on which the phosphor layer is formed to an upper surface of the frames.
11 . The method of claim 10 , wherein the coupling the upper substrate includes:
coating a second sealing paste on an upper surface of the frame and attaching the upper substrate on which the phosphor layer is formed on the second sealing paste; and
firing the second sealing paste at a predetermined temperature.
12 . The method of claim 11 , wherein the second sealing paste is fired at a temperature of about 420 to about 450° C.
13 . The method of claim 12 , wherein the second sealing paste is fired at a temperature of about 440° C.
14 . The method of claim 12 , wherein the second sealing paste is frit paste.
15 . The method of claim 14 , wherein the frit paste is a terpineol based paste
16 . The method of claim 10 , wherein the phosphor layer is formed by coating a phosphor on a lower surface of the upper substrate and firing the phosphor at a predetermined temperature.
17 . The method of claim 16 , wherein the phosphor is fired at a temperature of about 450 to about 490° C.
18 . The method of claim 17 , wherein the phosphor is fired at a temperature of about 480° C.
19 . The method of claim 10 , further comprising forming at least one upper electrode on the upper substrate.
20 . The method of claim 19 , wherein the upper electrodes are formed on an upper surface of the upper substrate before forming the phosphor layer on a lower surface of the upper substrate.
21 . The method of claim 20 , wherein the upper electrodes are formed by forming an electrode material in a predetermined shape on a lower surface of the upper substrate and firing the electrode material at a temperature of about 530 to about 590° C.