Apparatus and methods for isolating chemical vapor reactions at a substrate surface
View Patent ↗An apparatus and method for processing a substrate is provided. The apparatus comprises a reaction chamber, a substrate holder within the chamber, and first and second injector components. The reaction chamber has an upstream end and a downstream end, between which the substrate holder is positioned. The substrate holder is configured to support a substrate so that the substrate is within a plane extending generally toward the upstream and downstream ends. The first injector component is at the upstream end of the chamber and is configured to inject a first thin gas curtain toward a substrate supported by the substrate holder. The first injector component is configured to inject the first curtain generally along a first plane that is parallel to a first side of the substrate. The second injector component is configured to inject a second thin gas curtain toward the first side of the substrate. The second injector component is configured to inject the second gas curtain generally along a second plane oriented at an angle with respect to the first plane. The angled flows of source gases have reduced interdiffusion volume above the substrate, preferably resulting in deposition substantially along a line extending across the center of the substrate. The substrate can be rotated during deposition to produce a substantially uniform film on the substrate.
1. An apparatus for processing a substrate, comprising:
a reaction chamber having an upstream end and a downstream end;
a substrate holder positioned within the chamber between the upstream and downstream ends, the substrate holder configured to support a substrate so that the substrate is within a plane extending generally toward the upstream and downstream ends;
a first injector component at the upstream end of the chamber, the first injector component configured to inject a first thin gas curtain toward a substrate supported by the substrate holder, the first injector component configured to inject the first curtain generally along a first plane that is parallel to a first side of the substrate; and
a second injector component configured to inject a second thin gas curtain toward the first side of the substrate, the second injector component configured to inject the second gas curtain generally along a second plane oriented at an angle with respect to the first plane, wherein the first and second injector components are configured so that the first and second gas curtains intersect and mix together generally along and substantially throughout a line,
wherein the second injector component is configured so that the line intersects a center of a circular substrate supported by the substrate holder.
2. The apparatus of claim 1 , wherein the substrate holder is configured to rotate about a central axis that is substantially perpendicular to the first plane.
3. The apparatus of claim 1 , wherein the second injector component is configured so that the second plane intersects a circular substrate supported by the substrate holder, at a position between the first injector component and a center of the substrate.
4. The apparatus of claim 3 , wherein the second plane intersects the substrate along a line of intersection that is substantially perpendicular to a direction of flow of the first gas curtain.
5. The apparatus of claim 4 , wherein the second plane is substantially perpendicular to the first plane.
6. The apparatus of claim 4 , wherein the line of intersection intersects a radial line of the substrate, the radial line being substantially parallel to the direction of flow of the first gas curtain, the line of intersection intersecting the radial line at a position whose displacement from the substrate center is within half a radius of the substrate and one-tenth of the radius of the substrate.
7. The apparatus of claim 6 , wherein the line of intersection intersects the radial line at a position that is displaced from the substrate center by no more than one quarter of the radius of the substrate.
8. The apparatus of claim 1 , wherein at least one of the first and second injector components comprises a gas-injection slit.
9. The apparatus of claim 1 , wherein at least one of the first and second injector components comprises a plurality of aligned gas-injection openings.
10. The apparatus of claim 1 , wherein the second injector component is configured to inject the second gas curtain at a position within 5 cm from the first side of the substrate.
11. The apparatus of claim 1 , further comprising a source of excited species, wherein one or both of the first and second injector components is configured to inject the excited species.
12. The apparatus of claim 11 , wherein the second injector component is configured to inject the excited species at a distance from the first side of the substrate such that excited species elements that flow away from the second plane tend to collide and recombine in a neutral gas.
13. The apparatus of claim 11 , wherein the excited species comprises radicals.
14. The apparatus of claim 1 , wherein the substrate holder is configured to support the substrate in a substantially horizontal plane, and the first and second injector components are configured so that the first and second planes intersect along a line that is substantially vertically aligned with a center of the substrate.
15. The apparatus of claim 1 , wherein the second plane is oriented at an angle of within 30°-90° of the first plane.
16. The apparatus of claim 15 , wherein the second plane is oriented at an angle of within 85°-90° of the first plane.
17. The apparatus of claim 1 , wherein the reaction chamber is defined by quartz walls, the second injector component being formed of quartz and being fused with the quartz walls.