Interconnects having sealing structures to enable selective metal capping layers
View Patent ↗Methods of fabricating a capped interconnect for a microelectronic device which includes a sealing feature for any gaps between a capping layer and an interconnect and structures formed therefrom. The sealing features improve encapsulation of the interconnect, which substantially reduces or prevents electromigration and/or diffusion of conductive material from the capped interconnect.
1. A method of fabricating an interconnect structure, comprising:
providing an interconnect including a conductive material extending into a dielectric material layer, wherein an oxidizable material has been doped into the interconnect;
forming capping layer proximate said interconnect; and
forming a sealing structure to seal at least one gap of exposed interconnect conductive material between said capping layer and said dielectric layer by oxidizing a portion of the oxidizable material adjacent the at least one gap.
2. The method of claim 1 , further comprising annealing said oxidizable material to promote diffusion into said interconnect prior to oxidizing said oxidizable material.
3. The method of claim 1 , wherein doping said oxidizable material comprises doping an aluminum-containing material into said interconnect.
4. The method of claim 1 , wherein doping said oxidizable material comprises doping a tin-containing material into said interconnect.
5. The method of claim 1 , wherein providing an interconnect including a conductive material comprises providing an interconnect including a copper-containing conductive material.
6. A method of fabricating an interconnect structure, comprising:
providing a dielectric material layer;
forming an opening within said dielectric material layer;
forming a barrier material layer on at least one sidewall and bottom of said opening;
disposing a conductive material within said opening and abutting said barrier material layer;
forming capping layer proximate said conductive material; and
forming a sealing structure to seal at least one gap of exposed conductive material between said capping layer and said dielectric layer, wherein forming said sealing structure comprises doping an oxidizable material into said interconnect prior to the formation of said capping layer and oxidizing a portion of said oxidizable material adjacent said at least one gap after the formation of said capping layer.