Compliant thermal interface structure with vapor chamber
View Patent ↗A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one spring element comprises a spring portion, provides a heat path from the electronic device and provides mechanical compliance. The structure further includes a seal for containing a space between the top layer and the electronic device, wherein the space contained includes the plurality of spring elements, and a liquid with vaporizing capability disposed with the space contained.
1. A structure for cooling an electronic device, comprising:
a top layer disposed over the electronic device; and
a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one spring element comprises a spring portion and a fin portion, provides a heat path from the electronic device and provides mechanical compliance;
a seal for containing a space between the top layer and the electronic device, wherein the space contained includes the plurality of spring elements; and
a liquid with vaporizing capability disposed within the space contained.
2. The structure of claim 1 , wherein the fin portion includes a wicking capability for wicking the liquid.
3. The structure of claim 2 , wherein the spring portion of the at least one spring element includes a liquid return path.
4. The structure of claim 1 , further comprising: a heat-conducting layer disposed over the electronic device, wherein the fin portion of the at least one spring element is coupled to the heat-conducting layer.
5. The structure of claim 4 , wherein the heat-conducting layer comprises one or more of: thermally conductive paste; thermally conductive adhesive; solder; indium; and a conducting metal.
6. The structure of claim 1 , further comprising: a condenser coupled to the seal, whereby the condenser allows the liquid in a vaporized form to enter into the condenser, condense into a liquid form and then exit the condenser and return to the space contained.
7. The structure of claim 1 , wherein the spring portion of at least one of the spring elements comprises any one of a leaf spring and a helical spring composed of a heat conducting metal.
8. The structure of claim 7 , wherein at least one of the spring elements comprises copper.
9. The structure of claim 1 , wherein the structure comprises the electronic device and the electronic device comprises a microprocessor.
10. The structure of claim 1 , wherein the fin portion comprises part of a liquid distribution channel.
11. An information processing system, comprising: a microprocessor; and a structure for cooling the microprocessor, comprising:
a top layer disposed over the microprocessor; and
a plurality of spring elements disposed between the top layer and the microprocessor, wherein at least one spring element comprises a spring portion, provides a heat path from the microprocessor and provides mechanical compliance;
a seal for containing a space between the top layer and the microprocessor, wherein the space contained includes the plurality of spring elements; and
a liquid with vaporizing capability disposed within the space contained.
12. The information processing system of claim 11 , wherein the at least one spring element comprises a fin portion.
13. The information processing system of claim 12 , wherein the fin portion includes a wicking capability for wicking the liquid.
14. The information processing system of claim 12 , wherein the spring portion of the at least one spring element includes a liquid return path.
15. The information processing system of claim 12 , further comprising: a heat-conducting layer disposed over the microprocessor, wherein the fin portion of the at least spring element is coupled to the heat-conducting layer.
16. The information processing system of claim 15 , wherein the heat-conducting layer comprises one or more of: a thermally conductive paste; a thermally conductive adhesive; solder; indium; and a conducting metal.
17. The information processing system of claim 11 , further comprising: a condenser coupled to the seal, whereby the condenser allows the liquid in a vaporized form to enter into the condenser, condense into a liquid form and then exit the condenser and return to the space contained.
18. The information processing system of claim 11 , wherein the spring portion of at least one of the spring elements comprises any one of a leaf spring and a helical spring composed of a heat conducting metal.
19. The information processing system of claim 18 , wherein at least one of the spring elements is composed of copper or copper alloy.
20. The information processing system of claim 11 , wherein the fin portion comprises part of a liquid distribution channel.