Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same
View Patent ↗A wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow. A method of making the package is also provided, as is an information handling system (e.g., computer) adapted for utilizing such packages.
1. A wirebond electronic package comprising:
an organic laminate substrate having an external surface;
an electrically conductive circuit layer positioned on said external surface of said organic laminate substrate and including a plurality of wirebond pads;
a semiconductor chip positioned on said external surface of said organic laminate substrate and electrically coupled to said wirebond pads of said electrically conductive circuit layer; and
a pattern of thermally conductive material positioned on said external surface of said organic laminate relative to said wirebond pads of said electrical circuit, said pattern of thermally conductive material including a plurality of substantially concentric spaced-apart lines, said semiconductor chip positioned on said external surface of said organic laminate substrate being bonded to said external surface of said organic laminate substrate and said plurality of substantially concentric spaced-apart lines of said pattern of thermally conductive material so as to be thermally coupled to said plurality of substantially concentric spaced-apart lines of said pattern of thermally conductive material.
2. The wirebond electronic package of claim 1 wherein said organic laminate substrate includes a plurality of layers of dielectric material and a plurality of electrically conductive layers in addition to said electrically conductive circuit layer.
3. The wirebond electronic package of claim 2 wherein said dielectric material of said dielectric layers is selected from the group consisting of fiberglass-reinforced epoxy resins, polytetrafluoroethylene, polyimides, polyamides, cyanate resins and photo-imageable materials.
4. The wirebond electronic package of claim 1 wherein said electrically conductive layers are comprised of copper or copper alloy.
5. The wirebond electronic package of claim 1 wherein said plurality of wirebond pads are positioned within a substantially rectangular pattern on said external surface of said organic laminate substrate and said pattern of thermally conductive material is substantially surrounded by said substantially rectangular pattern of said wirebond pads.
6. The wirebond electronic package of claim 1 wherein each of said plurality of substantially concentric lines of said pattern of thermally conductive material are substantially rectangular in shape.
7. The wirebond electronic package of claim 1 wherein each of said plurality of substantially concentric lines of said pattern of thermally conductive material are comprised of copper or copper alloy.
8. The wirebond electronic package of claim 7 wherein each of said plurality of substantially concentric lines of said pattern of thermally conductive material include a gold layer thereon.
9. The wirebond electronic package of claim 1 wherein the width and length of said pattern of said thermally conductive material positioned on said external surface of said organic laminate is less than the width and length, respectively, of said semiconductor chip thermally coupled to said pattern.
10. The wirebond electronic package of claim 1 further including a plurality of thermally conductive members within said organic laminate substrate in contact with said plurality of substantially concentric lines of said pattern of thermally conductive material, selected ones of said thermally conductive members being in contact with a respective one of said concentric spaced-apart lines of said thermally conductive material.
11. The wirebond electronic package of claim 10 further including a plurality of openings within said organic laminate substrate, said plurality of said thermally conductive members being positioned within said openings.
12. The wirebond electronic package of claim 11 further including at least one thermally conductive layer within said organic laminate substrate, selected ones of said plurality of said thermally conductive members being physically connected to said at least one thermally conductive layer.
13. The wirebond electronic package of claim 10 wherein the diameter of each of said thermally conductive members is substantially the same as or less than the width of each of said concentric lines of said pattern of said thermally conductive material.