Stacked alignment mark and method for manufacturing thereof
View Patent ↗A stacked alignment mark. The stacked alignment mark comprises a first alignment mark and a second alignment mark. The first alignment mark is located in a first film layer, wherein the first alignment mark is composed of a plurality of conductive wires. The second alignment mark is located in a second film layer under the first film layer. The first alignment mark is located in a first region corresponding to a second region in which the second alignment mark is located. Moreover, the second alignment mark at least contains a third region directly under a space between each two adjacent first conductive wires.
1. A stacked alignment mark, comprising:
a first alignment mark located in a first film layer, wherein the first alignment mark is composed of a plurality of conductive wires; and
a second alignment mark located in a second film layer under the first film layer, wherein the first alignment mark is located in a first region corresponding to a second region in which the second alignment mark is located and the second alignment mark at least contains a third region directly under a space between each two adjacent first conductive wires.
2. The stacked alignment mark of claim 1 , wherein the second alignment mark is composed of a plurality of second conductive wires.
3. The stacked alignment mark of claim 1 , wherein the second alignment mark is in a form of window lattice structure.
4. The stacked alignment mark of claim 1 , wherein the second alignment mark is in a form of rectangle structure.
5. The stacked alignment mark of claim 1 , wherein the first alignment mark is selectively made of aluminum, tungsten, copper or alloy thereof.
6. The stacked alignment mark of claim 1 , wherein the second alignment mark is selectively made of aluminum, tungsten, copper or alloy thereof.
7. The stacked alignment mark of claim 1 , wherein the first film layer is selectively made of silicon oxide, silicon nitride, silicon oxy-nitride or other dielectric material.
8. The stacked alignment mark of claim 1 , wherein the second film layer is selectively made of silicon oxide, silicon nitride, silicon oxy-nitride or other dielectric material.