Heat dissipation device
View Patent ↗A heat dissipation device ( 1 ) includes a heat sink ( 10 ), a fan ( 20 ), and an air cooling member ( 30 ). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the temperature of the airflow below an average temperature of an atmosphere surrounding the heat dissipation device.
1. A heat dissipation device comprising:
a heat sink adapted for thermally contacting with a heat generating component of an electronic device;
an air cooling member; and
a fan having an outlet facing the heat sink and an inlet facing the air cooling member;
wherein an airflow produced by the fan passes through the air cooling member and is cooled by the cooling member, and then flows into the inlet and out of the outlet of the fan, and finally flows through the heat sink; and
wherein the fan is sandwiched between the heat sink and the air cooling member.
2. A heat dissipation device comprising:
a heat sink adapted for contacting with a heat generating component;
a fan generating an airflow through the heat sink;
a cooling member lowering a temperature of the airflow below an average temperature of an environment surrounding the heat dissipation device before the airflow flows through the heat sink, wherein the cooling member has a plurality of fins and the airflow flows through the fins before flows through the heat sink;
wherein the fan is sandwiched between the heat sink and the cooling member.