Integrated optics and electronics
View Patent ↗An optoelectronic device includes a submount and a lid. The submount includes a substrate and a lens and a laser above the substrate. The lid defines a cavity having a surface coated with a reflective material to form a 45 degree mirror. The mirror reflects a light from the laser to the lens and the light exits the optoelectronic device through the submount.
1. A method for forming a laser submount, comprising:
forming a lens above a substrate;
forming a top layer above the lens;
mounting a laser on the top layer above the lens and the substrate, wherein the lens is located above the substrate and below the laser;
further comprising, subsequent to said forming a lens and prior to said forming a top layer;
forming a planarization layer covering the lens; and
forming a interconnect above the planarization layer.
2. The method of claim 1 , wherein the substrate is selected from the group consisting of silicon, quartz, sodium borosilicate glass, sapphire, gallium arsenide, silicon carbide, and gallium phosphide.
3. The method of claim 1 , wherein the planarization layer is an oxide layer.
4. The method of claim 1 , wherein the top layer comprises a dielectric layer covering the interconnect, the method further comprising, subsequent to said forming a top layer and prior to said mounting a laser:
forming a contact pad above the dielectric layer, wherein the laser is electrically connected to the contact pad.
5. The method of claim 4 , further comprising, subsequent to said forming a top layer and prior to said mounting a laser:
forming a sealing ring above the dielectric layer and surrounding the contact pad and the laser.
6. The method of claim 1 , further comprising:
forming at least one of a passive integrated circuit and an active integrated circuit above the substrate.