Efficiency CPU cooling arrangement
View Patent ↗A CPU cooling assembly having a first, covering layer of conductive material above the upper surface of an enclosed, heat producing chip and a third, upper layer of conductive material (a heat sink base plate) thermally bonded to the first by an intermediate, second layer of thin, conforming material (thermal grease) that is far less thermally conductive, and more resistive, than the other two layers. The relative thickness relationship of the first and third, more conductive, layers is essentially reversed from the prior art, with first layer being relatively thicker than the third. This creates an overall lower resistance for the three layer sandwich.
1. In a CPU cooling assembly having a heat producing chip with an upper surface, a first layer of conductive material of thickness δ 1 and having a pre determined thermal conductivity thermally bonded to the chip upper surface and also having an upper surface, a third layer of conductive material of thickness δ 3 having a comparable conductivity to the first layer and having a lower surface, and a second layer of compliant conductive material of relatively small but fixed thickness δ 2 and relatively high, fixed and controlling thermal resistance as compared to the other two layers, with a total conductive path thickness δ t equal to the sum of δ 1 δ 2 , and δ 3 , the improvement comprising,
the ratio of the δ 1 thickness to the δ 3 thickness being greater than 1.0.
2. The CPU cooling assembly according to claim 1 , in which the ratio of the δ 1 thickness to the δ 3 thickness is greater than 1.0 and not greater than 10.0.
3. The CPU cooling assembly according to claim 1 , in which the first and third layers of conductive material have substantially the same conductivity.