Assignment of Assignor's Interest

Recorded: 2012-02-16 Received: 2012-02-16 Pages: 8

Assignor

DELPHI TECHNOLOGIES, INC.

Executed: 2011-12-19

Assignee

ESTERPALL B.V., LLC

2711 CENTERVILLE RD, SUITE 400, WILMINGTON, DE, 19808, UNITED STATES

Covered Properties (15)

Electronic Module Having Thermal Cooling Insert

Application: 12/074,424 →

Capillary-Assisted Compact Thermosiphon

Application: 11/412,287 →

High Performance Thermosiphon with Internally Enhanced Condensation

Application: 11/406,621 →

Technique for Improving Negative Potential Immunity of an Integrated Circuit

Application: 11/261,310 →

Led Array Cooling System

Application: 11/225,288 →

Technique for Determining a Load Current

Application: 11/220,767 →

Efficiency Cpu Cooling Arrangement

Application: 11/174,903 →

Electrostatic Discharge Protection Device

Application: 11/110,315 →

Technique for Improving Negative Potential Immunity of an Integrated Circuit

Application: 11/107,084 →

Protection Device for Handling Energy Transients

Application: 11/080,274 →

Methods and Compositions for Three-Dimensional Printing of Solid Objects

Application: 11/068,487 →

Automotive Ignition System with Battery Dependent Over-Dwell Protection

Application: 10/713,138 →

Electronic Assembly for Removing Heat from a Flip Chip

Application: 10/397,601 →

Compact Thermosiphon with Enhanced Condenser for Electronics Cooling

Application: 10/271,630 →

Thermal Dissipation Assembly for Electronic Components

Application: 10/099,898 →