Miniature radio frequency transceiver
The present application describes an electronically powered postage stamp or mailing label and including a radio frequency identification (RFID) device and system mounted between the opposing and facing major surfaces thereof. The RFID device and system includes an integrated circuit transceiver chip which is connected to and powered by a thin flat battery cell and is operated with a thin film RF antenna, all of which are mounted in side-by-side relationship on a thin base or support layer. These thin flat components are mounted in an essentially two dimensional planar configuration well suited for incorporation into the planar structure of a postage stamp or a mailing label. In addition, the RFID transceiver chip may be replaced with an electro-optically operated IC chip using, for example, LEDs or laser diodes for the propagation of light signals to an interrogator.
1 - 12 . (canceled)
13 . A process for manufacturing either a postage stamp or mailing or shipping label which is operative in either an RF signal or light signal communication mode which includes depositing one or more thin flat battery cells and an integrated circuit (IC) chip between base and cover members of said stamp or label and connecting said one or more of said thin flat battery cells to power said IC chip.
14 . The process defined in claim 13 wherein said cells and said IC chip are formed to thicknesses less than 30 mils.
15 . The process defined in claim 14 which includes constructing said IC chip as an RF transceiver and connecting a thin film antenna to said IC chip.
16 . The process defined in claim 15 wherein said base and cover members of said stamp or label are initially formed of one piece construction and are then folded one upon another after said cells, IC chip, and antenna have been deposited on one of said base or cover members.
17 . The process defined in claim 16 wherein said thin flat battery cells are constructed of lithium, polymerized vanadium-oxide, electrolyte, and copper.
18 . The process defined in claim 17 wherein said cell thickness is formed so as not to exceed a fraction of a mil.
19 . The invention defined in claim 18 which includes forming receiver, transmitter, control logic, and memory stages on said IC chip.
20 . The invention defined in claim 13 which includes forming an electro-optically light operated source on said IC chip as an alternative to RF communication.
21 . The invention defined in claim 13 which includes forming an optical detector on said IC chip as a means of receiving and detecting signals carried by light.
22 . The invention defined in claim 13 which includes forming an optical detector on said IC chip as a means of powering said RFID transceiver as an alternative to using a battery.