Electronic circuit package
View Patent ↗An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.
1. An electronic apparatus comprising:
a wiring substrate which includes wiring conductors; and
a plurality of semiconductor bare chips that are formed on said wiring substrate,
wherein said semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor, and
wherein said processor and said circuit are each formed in a bare chip.
2. An electronic apparatus according to claim 1 , wherein said wiring substrate is a multilayer wiring substrate.
3. An electronic apparatus according to claim 2 , wherein said multilayer wiring substrate is a ceramic substrate.
4. An electronic apparatus according to claim 1 , wherein a semiconductor bare chip corresponding to said circuit are connected respectively with said wiring substrate by wire bonding.
5. An electronic apparatus according to claim 1 , wherein the checking function of said circuit is a watch dog timer for resetting said processor when faults of said processor are detected.
6. An electronic apparatus according to claim 1 , wherein at least one of said semiconductor bare chips is a memory for storing data.