Patent Assignment
Reel/Frame 023486/0530
Assignment of Assignor's Interest
Recorded: 2009-11-09
Received: 2009-11-09
Pages: 5
Assignor
HITACHI, LTD.
Executed: 2009-11-05
Assignee
RISING SILICON, INCORPORATED
701 BRAZOS STREET, SUITE 720, AUSTIN, TX, 78701, UNITED STATES
Covered Properties
(20)
Electronic Circuit Package
Application:
12/222,329 →
Semiconductor Device with Improved Power Supply Control to a Plurality of Memory Arrays
Application:
12/165,681 →
Large-Capacity Semiconductor Memory with Improved Layout for Sub-Amplifiers to Increase Operational Speed
Application:
11/759,345 →
Large-Capacity Semiconductor Memory with Improved Layout for Sub-Amplifiers to Increase Speed
Application:
11/759,316 →
Semiconductor Device with Improved Power Supply Arrangement
Application:
11/727,429 →
Semiconductor Device with Improved Power Supply Arrangement
Application:
11/727,430 →
Electronic Circuit Package
Application:
11/714,747 →
Semiconductor Device with Power Down Arrangement for Reduced Power Consumption
Application:
11/483,649 →
Semiconductor Device Having a Power Down Mode
Application:
11/183,802 →
Electronic Circuit Package
Application:
11/180,733 →
Large-Capacity Semiconductor Memory with Improved Layout for Sub-Amplifiers to Increase Operational Speed
Application:
11/176,881 →
Semiconductor Device Having a Power Down Mode
Application:
11/084,138 →
Electronic Circuit Package
Application:
10/786,008 →
Semiconductor Device Having a Power Down Mode
Application:
10/724,781 →
Semiconductor Integrated Circuit Device, Process for Fabricating the Same, and Apparatus for Fabricating the Same
Application:
10/376,329 →
Electronic Circuit Package
Application:
10/370,518 →
Semiconductor Device, Such as a Synchronous Dram, Including a Control Circuit for Reducing Power Consumption
Application:
10/259,579 →
Semiconductor Memory
Application:
09/974,962 →
Semiconductor Intergrated Circuit Device Having a First Wiring Strip Exposed Through a Connecting Hole, a Transition-Metal Film in the Connecting Hole and an Aluminum Wiring Strip Thereover, and a Transition-Metal Nitride Film Between the Aluminum Wiring Strip And
Application:
09/899,921 →
Electronic Circuit Package
Application:
09/793,968 →