Micro-electro-mechanical system (MEMS) package having hydrophobic layer
A micro-electro-mechanical system (MEMS) package having a hydrophobic layer is disclosed. The MEMS package includes: a base substrate, with an MEMS element provided on a surface of the base substrate; a lid, spaced apart from the MEMS element provided on the base substrate and covering the MEMS element; a side sealing member provided on a side surface of the base substrate and the surface of the lid, thus hermetically sealing the MEMS element from an external environment; and a hydrophobic layer which covers the part of the side sealing member that is exposed to the external environment, thus removing the hydrophilia from the side sealing member.
1. A micro-electro-mechanical system (MEMS) package, comprising:
a base substrate, with an MEMS element provided on a surface of the base substrate;
a lid being spaced apart from the MEMS element provided on the base substrate and covering the MEMS element;
a side sealing member provided on a side surface of the base substrate and a surface of the lid, said side sealing member of a material composition and positioned on, and spanning between, the side surface of the base substrate and on the surface of the lid to hermetically seal the MEMS element from an external environment; and
a thin hydrophobic layer which covers part of the side sealing member exposed to the external environment, said hydrophobic layer of a composition and applied to the side sealing member to substantially prevent moisture and other gas from passing through the side sealing member.
2. The MEMS package according to claim 1 , wherein the lid is made of a transmissive material so that incident light beams are transmitted through the lid.
3. The MEMS package according to claim 2 , wherein the lid is provided with a nonreflective coat layer on at least one of opposite surfaces thereof, thus increasing light transmissivity of the incident light beams.
4. The MEMS package according to claim 1 , wherein the hydrophobic layer is configured as a thin, multi-layered structure.
5. A micro-electro-mechanical system (MEMS) package, comprising:
a base substrate, with an MEMS element provided on a surface of the base substrate;
a lid covering the MEMS element;
a spacer for spacing the lid apart from the base substrate and creating an operating chamber for the MEMS element;
a side sealing member provided on a side surface of the base substrate, the side surface of the spacer and a surface of the lid, said side sealing member of a material composition and disposed on the side surfaces of the base substrate and spacer and on the surface of the lid to hermetically seal the MEMS element from an external environment; and
a thin hydrophobic layer which covers part of the side sealing member exposed to the external environment, said hydrophobic layer of composition and applied to the side sealing member to substantially prevent moisture and other gas from passing through the side sealing member.
6. The MEMS package according to claim 5 , wherein the lid is made of a transmissive material so that incident light beams are transmitted through the lid.
7. The MEMS package according to claim 6 , wherein the lid is provided with a nonreflective coat layer on at least one of opposite surfaces thereof thus increasing light transmissivity of the incident light beams.
8. The MEMS package according to claim 5 , wherein the hydrophobic layer is configured as a thin multi-layered structure.