Method for adhering materials together
View Patent ↗The present invention provides a method adhering a layer to a substrate that features defining first and second interfaces by having a composition present between the layer and the substrate that forms covalent bonds to the layer and adheres to the substrate employing one or more of covalent bonds, ionic bonds and Van der Waals forces. In this manner, the strength of the adhering force of the layer to the composition is assured to be stronger than the adhering force of the layer to the composition formed from a predetermined adhering mechanism, i.e., an adhering mechanism that does not include covalent bonding.
1. A method of adhering a layer to an imprint lithography substrate, said method comprising:
(i) depositing a composition comprising a cross-linker and a multi-functional reactive compound upon said imprint lithography substrate, wherein the multi-functional reactive compound comprises:
(a) an organic backbone group; and
(b) a first functional group and a second functional group coupled to opposing ends of the organic backbone group, wherein the functional groups are different, and wherein the first functional group is acrylate and the second functional group is selected from the group consisting of a carboxylic group and an epoxy group;
(ii) thermally curing said composition, wherein thermally curing comprises:
(a) forming interactions between the imprint lithography substrate and the multi-functional reactive compound through the second functional group;
(b) forming interactions between the substrate and the second functional group of the multi-functional reactive compound through the cross-linker; and
(c) forming covalent or ionic bonds between the cross-linker and the multi-functional reactive compound through the second functional group;
(iii) depositing a polymerizable material on said thermally cured composition to form said layer; and
(iv) exposing the polymerizable material to actinic energy to polymerize the polymerizable material, wherein polymerizing the polymerizable material comprises forming covalent bonds between the polymerizable material and the multi-functional reactive compound in the thermally cured composition through the first functional group.
2. The method as recited in claim 1 , wherein said interactions are selected from a set of mechanisms consisting of covalent bonds, ionic bonds and van der Waals forces.
3. The method as recited in claim 1 , wherein depositing the polymerizable material comprises depositing discrete drops of the polymerizable material on the thermally cured composition.
4. The method of claim 1 , wherein the cross-linker and the multi-functional reactive compound are different.
5. The method of claim 1 , further comprising forming interactions between the cross-linker and the multi-functional reactive compound through the second functional group, wherein forming interactions between the cross-linker and the multi-functional reactive compound through the second functional group comprises cross-linking the composition.
6. A method of adhering a layer to an imprint lithography substrate, said method comprising:
(i) depositing a composition comprising a cross-linker and a multi-functional reactive compound upon said imprint lithography substrate, wherein the multi-functional reactive compound comprises:
(a) an organic backbone group; and
(b) a first functional group and a second functional group coupled to opposing ends of the organic backbone group, wherein the first functional group is an acrylate group and the second functional group is selected from the group consisting of a carboxylic group and an epoxy group;
(ii) solidifying said composition to form a solidified composition adhered to the imprint lithography substrate, wherein solidifying comprises:
(a) forming an interaction between the second functional group and the imprint lithography substrate, and wherein the interaction is selected from the group consisting of covalent bonds, ionic bonds, and van der Waals forces; and
(b) forming interactions between the substrate and the second functional group of the multi-functional reactive compound through the cross-linker; and
(c) forming covalent or ionic bonds between the cross-linker and the multi-functional reactive compound through the second functional group;
(iii) depositing discrete drops of a polymerizable material upon said solidified composition;
(iv) contacting the polymerizable material with an imprint lithography mold;
(v) polymerizing the polymerizable material, wherein polymerizing comprises forming covalent bonds between the polymerizable material and the first functional groups in the solidified composition during polymerization of the polymerizable material; and
(vi) separating the imprint lithography mold from the polymerized material.
7. The method as recited in claim 6 , wherein solidifying said composition comprises thermally curing said composition and wherein polymerizing the polymerizable material comprises exposing the polymerizable material to actinic energy.
8. The method of claim 6 , wherein the cross-linker and the multi-functional reactive compound are different.
9. The method of claim 6 , further comprising forming interactions between the cross-linker and the multi-functional reactive compound through the second functional group, wherein forming interactions between the cross-linker and the multi-functional reactive compound through the second functional group comprises cross-linking the composition.
10. A method of adhering a layer to an imprint lithography substrate, said method comprising:
(i) depositing a composition comprising an organic multi-functional reactive compound upon said imprint lithography substrate, wherein the multi-functional reactive compound comprises:
(a) an organic backbone group; and
(b) a first functional group and a second functional group coupled to opposing ends of the organic backbone group, wherein the functional groups are different, and wherein the first functional group is an acrylate group and the second functional group is selected from the group consisting of a carboxylic group and an epoxy group;
(ii) thermally curing said composition, wherein thermally curing comprises forming interactions between the imprint lithography substrate and the multi-functional reactive compound through the second functional group;
(iii) depositing a polymerizable material on said thermally cured composition to form said layer; and
(iv) exposing the polymerizable material to actinic energy to polymerize the polymerizable material, wherein polymerizing the polymerizable material comprises forming covalent bonds between the polymerizable material and the multi-functional reactive compound in the thermally cured composition through the first functional group.
11. The method of claim 10 , wherein the second functional group is a carboxylic group.
12. The method of claim 10 , wherein the second functional group is an epoxy group.
13. The method of claim 10 , wherein thermally curing further comprises forming interactions between the cross-linker and the imprint lithography substrate.
14. A method of adhering a layer to an imprint lithography substrate, said method comprising:
(i) depositing a composition comprising an organic multi-functional reactive compound upon said imprint lithography substrate, wherein the multi-functional reactive compound comprises:
(a) an organic backbone group; and
(b) a first functional group and a second functional group coupled to opposing ends of the organic backbone group, and wherein the first functional group is an acrylate group and the second functional group is selected from the group consisting of a carboxylic group and an epoxy group;
(ii) solidifying said composition to form a solidified composition adhered to the imprint lithography substrate, wherein solidifying comprises forming an interaction between the second functional group and the imprint lithography substrate, and wherein the interaction is selected from the group consisting of covalent bonds, ionic bonds, and van der Waals forces;
(iii) depositing discrete drops of a polymerizable material upon said solidified composition;
(iv) contacting the polymerizable material with an imprint lithography mold;
(v) polymerizing the polymerizable material, wherein polymerizing comprises forming covalent bonds between the polymerizable material and the first functional groups in the solidified composition during polymerization of the polymerizable material; and
(vi) separating the imprint lithography mold from the polymerized material.
15. The method of claim 14 , wherein the solidifying further comprises forming interactions between the cross-linker and imprint lithography substrate.