Method for producing an optical or electronic module provided with a plastic package
View Patent ↗A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.
1. A method for producing an optical or electronic module provided with a plastic package, comprising:
providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module,
encapsulating the at least one component with at least one polymer compound to form the plastic package,
after the encapsulation, ascertaining a position of the component by direct measurement of the position of the component in coordinates of a three-dimensional system of coordinates with respect to a system of coordinates external to the module, wherein the direct measurement of the position of the component is ascertained by means of an ultrasonic measuring device,
aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the directly ascertained position of the component, wherein the device for partially removing the polymer compound is aligned with respect to the system of coordinates external to the module,
partially removing the polymer compound using the device from the outside in such a way that the polymer compound between the operative region of the component and the outer side of the plastic package is at least partially removed.
2. The method according to claim 1 , wherein, for the direct measurement of the position of the component, its position is ascertained before the encapsulation with at least one polymer compound by means of an image recognition system and allowance is made for the information obtained in this way concerning the position of the component during the partial removal of the polymer compound.
3. The method according to claim 1 , wherein the at least one polymer compound is transparent and, for the direct measurement of the position of the component, its position is ascertained after the encapsulation by means of an image recognition system and allowance is made for the information obtained in this way concerning the position of the component during the partial removal of the polymer compound.
4. The method according to claim 1 , wherein the optical or electronic component is electrically contacted by electrical connections before the encapsulation, and the electrical connections lie in a region of the polymer compound in which partial removal of the polymer compound does not take place.
5. The method according to claim 4 , wherein the electrical connections are provided at least partially by bonding wires.
6. The method according to claim 1 , wherein the optical or electronic component is arranged on a carrier before the encapsulation.
7. The method according to claim 6 , wherein the carrier takes the form of a leadframe, having at least one planar carrier region and a plurality of contact leads, the plurality of contact leads being located at an edge region of the leadframe, and wherein the at least one optical or electronic component is arranged on the at least one planar carrier region.
8. The method according to claim 1 , wherein the optical component is an optoelectronic transmitting component or an optoelectronic receiving component.
9. The method according to claim 1 , wherein the electronic component is a sensor, in particular a pressure sensor or a temperature sensor.
10. The method according to claim 1 , wherein a milling device is used for the partial removal of the polymer compound.
11. The method according to claim 1 , wherein a laser ablation device is used for the partial removal of the polymer compound.
12. The method according to claim 1 , wherein the encapsulating step comprises embedding or press-molding the at least one component with the at least one polymer material.
13. The method according to claim 1 , wherein an opening introduced in the plastic package by the device for partially removing the polymer compound has an axis of symmetry which substantially coincides with the axis of the component.
14. A method for producing a module including a component having an operative region that is encapsulated inside a plastic package such that the operative region is at least partially exposed through an opening formed in the plastic package, the component being one of an optical component and an electrical component, the method comprising:
encapsulating the component using at least one polymer such that the polymer forms said plastic package over the component:
ascertaining a position of the component inside the plastic package by direct measurement of the position of the component in coordinates of a three-dimensional system of coordinates relative to a system of coordinates external to the module, wherein the direct measurement of the position of the component is ascertained by means of an ultrasonic measuring device;
aligning the component relative to a polymer removal device in accordance with the directly measured position of the component, wherein the polymer removal device is aligned with respect to the system of coordinates external to the module; and
removing a portion of the plastic package using the polymer removal device such that a portion of the polymer located between the operative region of the component and an outer surface of the plastic package is at least partially removed.