IP Library Granted Patent US 7,286,416
Granted Patent B2
US 7,286,416 · App. 11/194,777 · Granted Oct 23, 2007

Non-volatile semiconductor memory device and semiconductor memory device

Assignees: Renesas Technology Corp.; Hitachi ULSI Systems Co., Ltd.
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Quick Facts
Patent No.
US 7,286,416
App. No.
11/194,777
Granted
Oct 23, 2007
Kind
B2
Abstract

For each memory block, a predecoder for predecoding an applied address signal, an address latch circuit for latching the output signal of the predecoder, and a decode circuit for decoding an output signal of the address latch circuit and performing a memory cell selecting operation in a corresponding memory block are provided. Propagation delay of latch predecode signals can be made smaller and the margin for the internal read timing can be enlarged. In addition, the internal state of the decoder and memory cell selection circuitry are rest to an initial state when a memory cell is selected and the internal data output circuitry is reset to an initial state in accordance with a state of internal data reading. Thus, a non-volatile semiconductor memory device that can decrease address skew and realize an operation with sufficient margin is provided.

Claims (23)

1. A non-volatile semiconductor memory device, comprising:

a memory array having a plurality of non-volatile memory cells, arranged in rows and columns, each for storing data in a non-volatile manner;

predecode circuitry arranged along one side of said memory array, for predecoding an address signal designating a memory cell of said memory array, and generating a predecoded address signal;

address latch circuitry arranged along the one side of said memory array corresponding to said predecode circuitry, for latching the predecoded address signal from said predecode circuitry;

cell selecting circuitry responsive to latching of the address of said address latch circuitry, for selecting an addressed memory cell of said memory array in accordance with the latched predecoded address signal latched by said address latch circuitry; and

data reading circuitry for reading, in a data reading mode, data of the memory cell selected by said cell selecting circuitry, wherein

said memory array is divided into a plurality of blocks;

said address latch circuitry includes a plurality of address latch circuits arranged corresponding to respective blocks; and

said cell selecting circuitry includes a plurality of decode circuits, arranged corresponding to the blocks, each for decoding the address signal from the address latch circuit arranged for the corresponding block and generating a cell selection signal, with interconnections between said plurality of address latch circuits and corresponding decode circuits being made equal in length to each other.

2. The non-volatile semiconductor memory device according to claim 1 , wherein

said predecode circuitry includes a plurality of predecode circuits arranged corresponding to the blocks, and an output signal of each of said predecode circuits is applied to a corresponding address latch circuit.

3. A non-volatile semiconductor memory device, comprising:

a memory array having a plurality of non-volatile memory cells, arranged in rows and columns, each for storing data in a non-volatile manner;

predecode circuitry arranged along one side of said memory array, for predecoding an address signal designating a memory cell of said memory array, and generating a predecoded address signal;

address latch circuitry arranged along the one side of said memory array corresponding to said predecode circuitry, for latching the predecoded address signal from said predecode circuitry;

cell selecting circuitry responsive to latching of the address of said address latch circuitry, for selecting an addressed memory cell of said memory array in accordance with the latched predecoded address signal latched by said address latch circuitry; and

data reading circuitry for reading, in a data reading mode, data of the memory cell selected by said cell selecting circuitry, wherein

said cell selecting circuitry resets said address latch circuitry to an initial state, after a memory cell is selected.

4. The non-volatile semiconductor memory device according to claim 3 , wherein

said cell selecting circuitry further resets an internal state of said cell selecting circuitry to an initial state, after said memory cell is selected.

5. The non-volatile semiconductor memory device according to claim 4 , wherein

said data reading circuitry includes a sense amplifier circuit for amplifying data of said selected memory cell to generate an internal read data; and

said cell selecting circuitry resets said address latch circuitry in response to a signal controlling activation of said sense amplifier circuit.

Assignments (4)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2015
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 036022/0460 →
CHANGE OF NAME Recorded Sep 10, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024973/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2005
From: OOISHI, TSUKASA; UCHIYAMA, TOMOHIRO; MIYAZAKI, SHINYA
To: RENESAS TECHNOLOGY CORP.; HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 017093/0602 →
Priority Claims (2)
JP 2004-236069 · Aug 13, 2004 · national
JP 2004-355793 · Dec 8, 2004 · national
Continuity (1)
Related Publication 20060034142A1 · Feb 16, 2006