Semiconductor storage device and method of manufacturing the same
View Patent ↗A method of manufacturing a semiconductor storage device having a capacitive element having a dielectric layer having a perovskite-type crystal structure represented by general formula ABO 3 and a lower electrode and an upper electrode disposed so as to sandwich the dielectric layer therebetween; in the method are carried out forming, on a lower electrode conductive layer, using a MOCVD method, an initial nucleus containing at least one metallic element the same as a metallic element in the dielectric layer, forming, on the initial nucleus, using a MOCVD method, a buffer layer containing at least one metallic element the same as the metallic element contained in both the initial nucleus and the dielectric layer, in a higher content than the content of this metallic element contained in the initial nucleus, and forming, on the buffer layer, using a MOCVD method, the dielectric layer having a perovskite-type crystal structure.
1. A method of manufacturing a semiconductor storage device having a capacitive element having a dielectric layer having a perovskite-type crystal structure represented by general formula ABO 3 and a lower electrode and an upper electrode disposed so as to sandwich the dielectric layer therebetween, the method comprising:
forming, on a conductive layer constituting the lower electrode, using a metal organic chemical vapor deposition method, an initial nucleus containing at least one metallic element the same as a metallic element in the dielectric layer;
forming, on the initial nucleus, using a metal organic chemical vapor deposition method, a buffer layer containing at least one metallic element the same as the metallic element contained in both the initial nucleus and the dielectric layer, in a higher content than the content of this metallic element contained in the initial nucleus; and
forming, on the buffer layer, using a metal organic chemical vapor deposition method, the dielectric layer having a perovskite-type crystal structure.
2. The method of manufacturing a semiconductor storage device according to claim 1 , wherein the buffer layer contains lead as the metallic element contained in a higher content than the content of the same contained in the initial nucleus.
3. The method of manufacturing a semiconductor storage device according to claim 1 , wherein the buffer layer is formed to a thickness such as not to exert an influence on the crystal orientation of the dielectric layer.
4. The method of manufacturing a semiconductor storage device according to claim 1 , wherein the dielectric layer is a ferroelectric layer containing lead as an element A occupying the A lattice sites, and containing zirconium and titanium as elements B occupying the B lattice sites.
5. The method of manufacturing a semiconductor storage device according to claim 4 , wherein the initial nucleus comprises lead titanate, and the buffer layer comprises a metal oxide containing lead.
6. The method of manufacturing a semiconductor storage device according to claim 5 , wherein the buffer layer comprises lead titanate, and has a higher lead content than the lead content in the initial nucleus.
7. The method of manufacturing a semiconductor storage device according to claim 5 , wherein the buffer layer comprises lead oxide.
8. The method of manufacturing a semiconductor storage device according to claim 1 , wherein the conditions when forming the initial nucleus satisfy at least one of a temperature being lower than when forming the dielectric layer and a raw material gas pressure being higher than when forming the dielectric layer.
9. The method of manufacturing a semiconductor storage device according to claim 1 , wherein the lower electrode has, at least on a surface on a side of the dielectric layer, a film comprising at least one material selected from platinum, iridium, ruthenium, and oxides thereof.