Nitride based semiconductor device and process for preparing the same
View Patent ↗A process for preparing a nitride based semiconductor device in accordance with the present invention comprises growing a high temperature AlN single crystal layer on a substrate; growing a first GaN layer on the high temperature AlN single crystal layer in a first V/III ratio, under a first pressure of 300 Torr or more, such that the predominant direction of growth is the lateral direction; and growing a second GaN layer on the first GaN layer in a second V/III ratio lower than the first V/III ratio, under a second pressure lower than the first pressure such that the predominant direction of growth is the lateral direction.
1. A process for preparing a nitride based semiconductor device, comprising:
growing a high temperature AlN single crystal layer on a substrate;
growing a first GaN layer on the high temperature AlN single crystal layer in a first V/III ratio, under a first pressure of 300 Torr or more, such that the predominant direction of growth is the lateral direction; and
growing a second GaN layer on the first GaN layer in a second V/III ratio lower than the first V/III ratio, under a second pressure lower than the first pressure.
2. The process as set forth in claim 1 , wherein the high temperature AlN single crystal layer has a thickness of 200 to 1000 Å.
3. The process as set forth in claim 1 , wherein the step of growing the high temperature AlN single crystal layer is performed at a temperature of 1050 to 1200° C.
4. The process as set forth in claim 3 , wherein the steps of growing the first GaN layer and second GaN layer are performed at almost the same temperature as that of growing the AlN single crystal layer.
5. The process as set forth in claim 1 , wherein the first pressure is within the range of 300 to 760 Torr, and
the step of growing the first GaN layer includes forming a GaN nucleation seed layer for two-dimensional growth in a V/III ratio of at least 10000 on the AlN single crystal layer, and forming the first GaN layer in a V/III ratio of at least 6000 using the GaN nucleation seed layer.
6. The process as set forth in claim 5 , wherein the V/III ratio for forming the GaN nucleation seed layer is within the range of 10000 to 150000, and the V/III ratio for forming the first GaN layer is within the range of 6000 to 12000.
7. The process as set forth in claim 6 , wherein the V/III ratio for forming the nucleation seed is higher than the V/III ratio for forming the first GaN layer.
8. The process as set forth in claim 1 , wherein the second pressure is 100 Torr or less, and the second V/III ratio is 3000 or less.
9. The process as set forth in claim 8 , wherein the second pressure is between 10 and 50 Torr, and the second V/III ratio is between 800 and 3000.
10. The process as set forth in claim 1 , wherein the crystal defect density of the first GaN layer is 10 9 cm −3 or less.
11. The process as set forth in claim 1 , wherein the crystal defect density of the second GaN layer is 10 8 cm −3 or less.
12. The process as set forth in claim 1 , wherein the substrate is a silicone substrate.